The multipurpose integrated electronic processor

At the University of Ottawa, a Multipurpose Integrated Electronic Processor (MIEP) is being built for basic research in integrated electronics and its related fields. When completed, the MIEP will permit controlled deposition of thin films, electron-beam micromachining, topological inspection and ch...

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Bibliographische Detailangaben

Veröffentlicht in:	Proceedings of the IEEE 1964-01, Vol.52 (12), p.1475-1478
Hauptverfasser:	Glinski, G.S., Mousseau, T.J., Samaroo, W.R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Dielectric substrates Dielectric thin films Fabrication Inspection Machining Micromachining Semiconductor thin films Sputtering Thin film circuits Titanium
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