The multipurpose integrated electronic processor

The multipurpose integrated electronic processor

At the University of Ottawa, a Multipurpose Integrated Electronic Processor (MIEP) is being built for basic research in integrated electronics and its related fields. When completed, the MIEP will permit controlled deposition of thin films, electron-beam micromachining, topological inspection and ch...

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Veröffentlicht in:Proceedings of the IEEE 1964-01, Vol.52 (12), p.1475-1478
Hauptverfasser: Glinski, G.S., Mousseau, T.J., Samaroo, W.R.
Format: Artikel
Sprache:eng
Schlagworte:
Dielectric substrates
Dielectric thin films
Fabrication
Inspection
Machining
Micromachining
Semiconductor thin films
Sputtering
Thin film circuits
Titanium
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container_end_page 1478
container_issue 12
container_start_page 1475
container_title Proceedings of the IEEE
container_volume 52
creator Glinski, G.S.
Mousseau, T.J.
Samaroo, W.R.
description At the University of Ottawa, a Multipurpose Integrated Electronic Processor (MIEP) is being built for basic research in integrated electronics and its related fields. When completed, the MIEP will permit controlled deposition of thin films, electron-beam micromachining, topological inspection and chemical analysis of the films. These processes will be achieved without the need of moving the substrate from one chamber to another, with the associated problems of reregistration and maintaining clean surfaces. The primary aim of the project is the fabrication of thin-film integrated circuits containing micron-sized active and passive elements.
doi_str_mv 10.1109/PROC.1964.3434
format Article
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subjects Dielectric substrates
Dielectric thin films
Fabrication
Inspection
Machining
Micromachining
Semiconductor thin films
Sputtering
Thin film circuits
Titanium
title The multipurpose integrated electronic processor
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