The evaluation of wafer thinning and singulating processes to enhance chip strength

For several kinds of advanced applications, such as RFID, telecommunication, portable electronics, or wearable electronics, the need of packaged semiconductor chip thick is getting thinner drastically. One representative technology is to embed an active device into an organic substrate by sequential...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shoulung Chen, Tzu-Ying Kuo, Hsu-Tien Hu, Jyh-Rong Lin, Shan-Pu Yu
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Chip scale packaging Dry etching Electronics packaging Laser beam cutting Plasma applications Plasma materials processing Radiofrequency identification Semiconductor device packaging Semiconductor device reliability Substrates
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