Study of flip chip solder joint cracks under temperature cycling using a laser ultrasound inspection system

Study of flip chip solder joint cracks under temperature cycling using a laser ultrasound inspection system

The current techniques for nondestructive quality evaluation of bumped solder joint connections in electronics packages are either incapable of detecting solder joint cracks, or unsuitable for in-line inspection due to cost and throughput reasons. As an alternative, a novel solder joint inspection s...

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Hauptverfasser: Lizheng Zhang, Ume, I.C., Gamalski, J., Galuschki, K.-P.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Costs
Electronics packaging
Fiber lasers
Flip chip solder joints
Inspection
Soldering
Surface cracks
Surface emitting lasers
Temperature
Ultrasonic imaging
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creator Lizheng Zhang
Ume, I.C.
Gamalski, J.
Galuschki, K.-P.
description The current techniques for nondestructive quality evaluation of bumped solder joint connections in electronics packages are either incapable of detecting solder joint cracks, or unsuitable for in-line inspection due to cost and throughput reasons. As an alternative, a novel solder joint inspection system is being developed. The system projects short laser pulses onto specimen surface through optic fibers to induce structural vibration. The induced surface displacements are then measured by a laser Doppler vibrometer. A number of digital signal processing algorithms, such as error ratio and correlation coefficient, were used to analyze the vibration responses and identify defective specimens. This paper presents a systematic study of parameters such as error ratio, correlation coefficient, resonant frequency, electrical resistance, and the extension of solder joint cracks, to quantitatively characterize the relationships among them. These relationships verified that the laser ultrasound inspection system provides a reliable and efficient way to evaluate flip chip solder joint cracks nondestructively.
doi_str_mv 10.1109/ECTC.2005.1441421
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This paper presents a systematic study of parameters such as error ratio, correlation coefficient, resonant frequency, electrical resistance, and the extension of solder joint cracks, to quantitatively characterize the relationships among them. These relationships verified that the laser ultrasound inspection system provides a reliable and efficient way to evaluate flip chip solder joint cracks nondestructively.</abstract><pub>IEEE</pub><doi>10.1109/ECTC.2005.1441421</doi></addata></record>
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subjects Costs
Electronics packaging
Fiber lasers
Flip chip solder joints
Inspection
Soldering
Surface cracks
Surface emitting lasers
Temperature
Ultrasonic imaging
title Study of flip chip solder joint cracks under temperature cycling using a laser ultrasound inspection system
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