The implementation of ASIC packaging design and manufacturing technologies on high performance networking products

This paper briefly presents how silicon integration and advances in packaging technology have enabled higher performance networking products, and is followed by discussions of how a system-level integrated approach is needed to address the challenges of the next generation products. Different method...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Camerlo, S., Jie Xue, Wheling Cheng, Duong, R., Shanker, B.J., Yida Zou, Ahmad, M., Brillhart, M., Hubbard, K., Priore, S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Application specific integrated circuits Assembly Manufacturing Packaging Power system reliability Product design Random access memory Silicon Thermal management Thermal stresses
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