The design of miniature 3D RF module

High-density packaging has become an important driver for new portable electronics. Miniature discrete components, flip-chip bonding of ICs and thin multilayer substrates are essentials for a small product. Further size reduction can be achieved with the integration of various passives, and modern c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lahteenmaki, J., Miettinen, J., Heino, P.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Driver circuits Electronic packaging thermal management Electronics packaging Nonhomogeneous media Radio frequency Semiconductor device packaging Substrates System testing Wiring
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!