Methods of underfill flow voids detection and minimization in flip chip package

Rheological properties of underfills were measured at dispensing temperatures. The surface energy of different substrates and wetting angles of underfills on the substrates were also measured and showed differences between different substrates. It was observed that the viscosity of an underfill and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wang, J., Hsu, M., Dunaway, P., He, D., Buckmann, K.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Energy measurement Flip chip Fluid flow measurement Metrology Minimization methods Packaging Rheology Semiconductor device measurement Temperature measurement Viscosity
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