Effect of underfill materials on Pb-free flip chip package reliability

In this study, Sn/Ag/Cu Pb-free solder paste was printed and reflowed onto a thin film Al/Ni(V)/Cu under bump metallization (UBM) on a 4mm /spl times/ 5mm die and, packaged in a 5mm /spl times/ 6mm LGA (land grid array) package using four different underfill materials with a range of different mater...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Jamin Ling, Tie Wang, Ming Ying, Tessier, T., Shim, I.K.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Capacitive sensors Conducting materials Creep Electric shock Field emitter arrays Flip chip Materials reliability Packaging Testing Thermal stresses
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