Fabrication and design of a heat transfer micro channel system at low temperature process by MEMS technique
The paper describes a low temperature fabrication technique for a micro channel system in which a low thermal conductivity material can be used to form the channel wall. This channel can provide a uniform heat flux boundary condition and good insulation on the wall to prevent heat loss from the chan...
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| creator | Liu, C.W. Chie Gau Yang, C.S. Dai, B.T. |
| description | The paper describes a low temperature fabrication technique for a micro channel system in which a low thermal conductivity material can be used to form the channel wall. This channel can provide a uniform heat flux boundary condition and good insulation on the wall to prevent heat loss from the channel to the outside ambient. Therefore, detailed micro-scale flow and heat transfer process and information along the channel can be studied. Design considerations and fabrication techniques involved in this processes are discussed. A final measurement for the validation of the heaters and the sensors fabricated and a study of the heat transfer coefficient distributions inside the micro channel are presented. |
| doi_str_mv | 10.1109/ICSENS.2004.1426243 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>pascalfrancis_6IE</sourceid><recordid>TN_cdi_ieee_primary_1426243</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1426243</ieee_id><sourcerecordid>17875471</sourcerecordid><originalsourceid>FETCH-LOGICAL-i135t-f7ae423fec28d6e5a58f74beb92ef34e57014c65146e44945f4a0552427779eb3</originalsourceid><addsrcrecordid>eNpFkE1LAzEQhgMi-NVf0MtcPLbmc7N7lNJqodVD9Vxm04mNbrNrskX6712o4FzegedhYF7GxoJPheDVw3K2mb9sppJzPRVaFlKrC3bDbclVWVRSXrFRzp98GFUVStpr9rXAOgWHfWgjYNzBjnL4iNB6QNgT9tAnjNlTgkNwqQW3xxipgXzKPR1gEJr2B4a1o4T9MRF0qXWUM9QnWM_Xm4G5fQzfR7pjlx6bTKO_vGXvi_nb7Hmyen1azh5XkyCU6SfeImmpPDlZ7goyaEpvdU11JckrTcZyoV1hhC5I60obr5EbI7W01lZUq1t2f77bYXbY-OEBF_K2S-GA6bQVtrRGWzF447MXiOgfn3tTv9RAZEc</addsrcrecordid><sourcetype>Index Database</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Fabrication and design of a heat transfer micro channel system at low temperature process by MEMS technique</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Liu, C.W. ; Chie Gau ; Yang, C.S. ; Dai, B.T.</creator><creatorcontrib>Liu, C.W. ; Chie Gau ; Yang, C.S. ; Dai, B.T.</creatorcontrib><description>The paper describes a low temperature fabrication technique for a micro channel system in which a low thermal conductivity material can be used to form the channel wall. This channel can provide a uniform heat flux boundary condition and good insulation on the wall to prevent heat loss from the channel to the outside ambient. Therefore, detailed micro-scale flow and heat transfer process and information along the channel can be studied. Design considerations and fabrication techniques involved in this processes are discussed. A final measurement for the validation of the heaters and the sensors fabricated and a study of the heat transfer coefficient distributions inside the micro channel are presented.</description><identifier>ISBN: 0780386922</identifier><identifier>ISBN: 9780780386921</identifier><identifier>DOI: 10.1109/ICSENS.2004.1426243</identifier><language>eng</language><publisher>Piscataway NJ: IEEE</publisher><subject>Applied sciences ; Boundary conditions ; Communication, education, history, and philosophy ; Conducting materials ; Electronics ; Exact sciences and technology ; Fabrication ; General equipment and techniques ; Heat transfer ; Instruments, apparatus, components and techniques common to several branches of physics and astronomy ; Insulation ; Laboratories ; Micro- and nanoelectromechanical devices (mems/nems) ; Micromechanical devices ; Physics ; Physics literature and publications ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing ; Temperature sensors ; Thermal conductivity ; Thermal sensors</subject><ispartof>Proceedings of IEEE Sensors, 2004, 2004, p.623-626 vol.2</ispartof><rights>2006 INIST-CNRS</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1426243$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1426243$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=17875471$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Liu, C.W.</creatorcontrib><creatorcontrib>Chie Gau</creatorcontrib><creatorcontrib>Yang, C.S.</creatorcontrib><creatorcontrib>Dai, B.T.</creatorcontrib><title>Fabrication and design of a heat transfer micro channel system at low temperature process by MEMS technique</title><title>Proceedings of IEEE Sensors, 2004</title><addtitle>ICSENS</addtitle><description>The paper describes a low temperature fabrication technique for a micro channel system in which a low thermal conductivity material can be used to form the channel wall. This channel can provide a uniform heat flux boundary condition and good insulation on the wall to prevent heat loss from the channel to the outside ambient. Therefore, detailed micro-scale flow and heat transfer process and information along the channel can be studied. Design considerations and fabrication techniques involved in this processes are discussed. A final measurement for the validation of the heaters and the sensors fabricated and a study of the heat transfer coefficient distributions inside the micro channel are presented.</description><subject>Applied sciences</subject><subject>Boundary conditions</subject><subject>Communication, education, history, and philosophy</subject><subject>Conducting materials</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Fabrication</subject><subject>General equipment and techniques</subject><subject>Heat transfer</subject><subject>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</subject><subject>Insulation</subject><subject>Laboratories</subject><subject>Micro- and nanoelectromechanical devices (mems/nems)</subject><subject>Micromechanical devices</subject><subject>Physics</subject><subject>Physics literature and publications</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing</subject><subject>Temperature sensors</subject><subject>Thermal conductivity</subject><subject>Thermal sensors</subject><isbn>0780386922</isbn><isbn>9780780386921</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2004</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFkE1LAzEQhgMi-NVf0MtcPLbmc7N7lNJqodVD9Vxm04mNbrNrskX6712o4FzegedhYF7GxoJPheDVw3K2mb9sppJzPRVaFlKrC3bDbclVWVRSXrFRzp98GFUVStpr9rXAOgWHfWgjYNzBjnL4iNB6QNgT9tAnjNlTgkNwqQW3xxipgXzKPR1gEJr2B4a1o4T9MRF0qXWUM9QnWM_Xm4G5fQzfR7pjlx6bTKO_vGXvi_nb7Hmyen1azh5XkyCU6SfeImmpPDlZ7goyaEpvdU11JckrTcZyoV1hhC5I60obr5EbI7W01lZUq1t2f77bYXbY-OEBF_K2S-GA6bQVtrRGWzF447MXiOgfn3tTv9RAZEc</recordid><startdate>2004</startdate><enddate>2004</enddate><creator>Liu, C.W.</creator><creator>Chie Gau</creator><creator>Yang, C.S.</creator><creator>Dai, B.T.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope><scope>IQODW</scope></search><sort><creationdate>2004</creationdate><title>Fabrication and design of a heat transfer micro channel system at low temperature process by MEMS technique</title><author>Liu, C.W. ; Chie Gau ; Yang, C.S. ; Dai, B.T.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i135t-f7ae423fec28d6e5a58f74beb92ef34e57014c65146e44945f4a0552427779eb3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Applied sciences</topic><topic>Boundary conditions</topic><topic>Communication, education, history, and philosophy</topic><topic>Conducting materials</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Fabrication</topic><topic>General equipment and techniques</topic><topic>Heat transfer</topic><topic>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</topic><topic>Insulation</topic><topic>Laboratories</topic><topic>Micro- and nanoelectromechanical devices (mems/nems)</topic><topic>Micromechanical devices</topic><topic>Physics</topic><topic>Physics literature and publications</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing</topic><topic>Temperature sensors</topic><topic>Thermal conductivity</topic><topic>Thermal sensors</topic><toplevel>online_resources</toplevel><creatorcontrib>Liu, C.W.</creatorcontrib><creatorcontrib>Chie Gau</creatorcontrib><creatorcontrib>Yang, C.S.</creatorcontrib><creatorcontrib>Dai, B.T.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection><collection>Pascal-Francis</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Liu, C.W.</au><au>Chie Gau</au><au>Yang, C.S.</au><au>Dai, B.T.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Fabrication and design of a heat transfer micro channel system at low temperature process by MEMS technique</atitle><btitle>Proceedings of IEEE Sensors, 2004</btitle><stitle>ICSENS</stitle><date>2004</date><risdate>2004</risdate><spage>623</spage><epage>626 vol.2</epage><pages>623-626 vol.2</pages><isbn>0780386922</isbn><isbn>9780780386921</isbn><abstract>The paper describes a low temperature fabrication technique for a micro channel system in which a low thermal conductivity material can be used to form the channel wall. This channel can provide a uniform heat flux boundary condition and good insulation on the wall to prevent heat loss from the channel to the outside ambient. Therefore, detailed micro-scale flow and heat transfer process and information along the channel can be studied. Design considerations and fabrication techniques involved in this processes are discussed. A final measurement for the validation of the heaters and the sensors fabricated and a study of the heat transfer coefficient distributions inside the micro channel are presented.</abstract><cop>Piscataway NJ</cop><pub>IEEE</pub><doi>10.1109/ICSENS.2004.1426243</doi></addata></record> |
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| identifier | ISBN: 0780386922 |
| ispartof | Proceedings of IEEE Sensors, 2004, 2004, p.623-626 vol.2 |
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| language | eng |
| recordid | cdi_ieee_primary_1426243 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Applied sciences Boundary conditions Communication, education, history, and philosophy Conducting materials Electronics Exact sciences and technology Fabrication General equipment and techniques Heat transfer Instruments, apparatus, components and techniques common to several branches of physics and astronomy Insulation Laboratories Micro- and nanoelectromechanical devices (mems/nems) Micromechanical devices Physics Physics literature and publications Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Sensors (chemical, optical, electrical, movement, gas, etc.) remote sensing Temperature sensors Thermal conductivity Thermal sensors |
| title | Fabrication and design of a heat transfer micro channel system at low temperature process by MEMS technique |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T02%3A53%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-pascalfrancis_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Fabrication%20and%20design%20of%20a%20heat%20transfer%20micro%20channel%20system%20at%20low%20temperature%20process%20by%20MEMS%20technique&rft.btitle=Proceedings%20of%20IEEE%20Sensors,%202004&rft.au=Liu,%20C.W.&rft.date=2004&rft.spage=623&rft.epage=626%20vol.2&rft.pages=623-626%20vol.2&rft.isbn=0780386922&rft.isbn_list=9780780386921&rft_id=info:doi/10.1109/ICSENS.2004.1426243&rft_dat=%3Cpascalfrancis_6IE%3E17875471%3C/pascalfrancis_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1426243&rfr_iscdi=true |