A low-power CMOS-VLSI circuit for signal conditioning in integrated capacitive sensors

Capacitive sensor manufacturing processes are rarely compatible with CMOS technologies and, thus, monolithic integration of sensing device and signal-conditioning IC is often not possible. Multi-chip packaging and wire bonding is employed instead, to interconnect sensor and IC dies. In such cases, s...

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Bibliographische Detailangaben
Hauptverfasser:	Dimitropoulos, P.D., Nikolaidis, S.P., Karampatzakis, D.P., Stamoulis, G.I.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Capacitive sensors Clocks CMOS process CMOS technology Communication, education, history, and philosophy Exact sciences and technology Fundamental areas of phenomenology (including applications) General equipment and techniques Instruments, apparatus, components and techniques common to several branches of physics and astronomy Integrated circuit interconnections Integrated circuit technology Laser optical systems: design and operation Manufacturing processes Monolithic integrated circuits Operational amplifiers Optics Parasitic capacitance Physics Physics literature and publications Resonators, cavities, amplifiers, arrays, and rings Sensors (chemical, optical, electrical, movement, gas, etc.) remote sensing
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