Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance [IC cooling applications]

We report a simple method to improve bondline formation kinetics by means of a hierarchical set of channels patterned into one of the surfaces. These channel arrays are used to improve the gap squeezing and cooling of single and multiple flip chip electronic modules with highly viscous fluids and th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Brunschwiler, T., Kloter, U., Linderman, R., Rothuizen, H., Michel, B.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Application specific integrated circuits Bonding Conducting materials Electronics cooling Flip chip Kinetic theory Surface resistance Thermal conductivity Thermal loading Thermal resistance
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