SoC-Mobinet: broadband transceiver design challenges

Summary form only given. Decreasing feature size and increasing system complexity enables to map complex systems onto one die (SoC - system on chip) or into one package (SiP - system in package). This reduces development, production and packaging costs of the integrated circuit, increases integratio...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Dielacher, F.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Baseband Costs Educational institutions GSM Integrated circuit packaging Integrated circuit technology Production Silicon Space technology Transceivers
Online-Zugang:	Volltext bestellen
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