Reliability assessment of high density fine pitch lead-free flip chip package

It is now possible to build high performance integrated circuit (IC) due to the recent advancement in the chip fabrication process. To meet the high performance IC, the chip's input/output (I/O) counts have to increase and this resulted in fine pitch and large IC. In addition, there is a drive...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ser Choong Chong, Simon Ting, Tan Yeow Meng, Chai Tai Chong, Srinivasamurthy Sampath, Hnin Wai Yin, Lim, S., Cheng Chek Kweng
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Chip scale packaging Environmentally friendly manufacturing techniques Flip chip Integrated circuit packaging Integrated circuit reliability Lead Moisture Passivation Temperature sensors Testing
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!