The development of a test vehicle for applications in ambient electronic systems using very thin flexible substrate
In this work the development and characterisation of a very thin flexible substrate, with thickness ranging from 3 microns to 25 microns, was presented. The work analyses the stress generated in thin flexible substrate and determines the critical thickness to avoid wrinkling in the substrate. This s...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 374 |
|---|---|
| container_issue | |
| container_start_page | 369 |
| container_title | |
| container_volume | |
| creator | Majeed, B. Delaney, K. Barton, J. Razeeb, K.M. MacCarthy, N. O'mathuna, C. |
| description | In this work the development and characterisation of a very thin flexible substrate, with thickness ranging from 3 microns to 25 microns, was presented. The work analyses the stress generated in thin flexible substrate and determines the critical thickness to avoid wrinkling in the substrate. This substrate is then used to package test chips into a highly miniaturised 3D module. The 3D module consists of 4 IC's each having thickness of 50 microns and total module is approximately 450 microns in thickness and with a footprint of 18/spl times/7mm/sup 2/. This module is being developed as a technological demonstrator for the "I-Seed". The I-seed is an NMRC envisioned distributed autonomous micromodule that would interact, respond and learn from its surroundings making integration of engineering, computer science and human intelligence a reality. |
| doi_str_mv | 10.1109/EPTC.2004.1396636 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1396636</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1396636</ieee_id><sourcerecordid>1396636</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-d070fa051b50b87807dccf0379341b8e2f4b99218fc562ff11ee06a424a9fa23</originalsourceid><addsrcrecordid>eNotUEtLxDAYDIigrP0B4iV_oDWPNk2OUtYHLOih9yVJv9hI-qDJLvbf28UdBuYyMzCD0CMlBaVEPe-_2qZghJQF5UoILm5QpmpJNnIpGa3uUBbjD9nAVSkqdY9i2wPu4AxhmgcYE54c1jhBTPgMvbcBsJsWrOc5eKuTn8aI_Yj1YPzFDQFsWqbRWxzXmGCI-BT9-L2FlxWnfrO6AL_ebD3xZGJadIIHdOt0iJBddYfa133bvOeHz7eP5uWQe1pXKe9ITZwmFTUVMfIyo7PWEV4rXlIjgbnSKMWodLYSzDlKAYjQJSu1cprxHXr6r_UAcJwXP-hlPV6f4X-ty1uz</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>The development of a test vehicle for applications in ambient electronic systems using very thin flexible substrate</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Majeed, B. ; Delaney, K. ; Barton, J. ; Razeeb, K.M. ; MacCarthy, N. ; O'mathuna, C.</creator><creatorcontrib>Majeed, B. ; Delaney, K. ; Barton, J. ; Razeeb, K.M. ; MacCarthy, N. ; O'mathuna, C.</creatorcontrib><description>In this work the development and characterisation of a very thin flexible substrate, with thickness ranging from 3 microns to 25 microns, was presented. The work analyses the stress generated in thin flexible substrate and determines the critical thickness to avoid wrinkling in the substrate. This substrate is then used to package test chips into a highly miniaturised 3D module. The 3D module consists of 4 IC's each having thickness of 50 microns and total module is approximately 450 microns in thickness and with a footprint of 18/spl times/7mm/sup 2/. This module is being developed as a technological demonstrator for the "I-Seed". The I-seed is an NMRC envisioned distributed autonomous micromodule that would interact, respond and learn from its surroundings making integration of engineering, computer science and human intelligence a reality.</description><identifier>ISBN: 9780780388215</identifier><identifier>ISBN: 0780388216</identifier><identifier>DOI: 10.1109/EPTC.2004.1396636</identifier><language>eng</language><publisher>IEEE</publisher><subject>Assembly ; Chip scale packaging ; Electronic equipment testing ; Electronics packaging ; Hardware ; Intelligent sensors ; Sensor systems ; System testing ; Vehicles ; Wafer scale integration</subject><ispartof>Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004, p.369-374</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1396636$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,4036,4037,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1396636$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Majeed, B.</creatorcontrib><creatorcontrib>Delaney, K.</creatorcontrib><creatorcontrib>Barton, J.</creatorcontrib><creatorcontrib>Razeeb, K.M.</creatorcontrib><creatorcontrib>MacCarthy, N.</creatorcontrib><creatorcontrib>O'mathuna, C.</creatorcontrib><title>The development of a test vehicle for applications in ambient electronic systems using very thin flexible substrate</title><title>Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)</title><addtitle>EPTC</addtitle><description>In this work the development and characterisation of a very thin flexible substrate, with thickness ranging from 3 microns to 25 microns, was presented. The work analyses the stress generated in thin flexible substrate and determines the critical thickness to avoid wrinkling in the substrate. This substrate is then used to package test chips into a highly miniaturised 3D module. The 3D module consists of 4 IC's each having thickness of 50 microns and total module is approximately 450 microns in thickness and with a footprint of 18/spl times/7mm/sup 2/. This module is being developed as a technological demonstrator for the "I-Seed". The I-seed is an NMRC envisioned distributed autonomous micromodule that would interact, respond and learn from its surroundings making integration of engineering, computer science and human intelligence a reality.</description><subject>Assembly</subject><subject>Chip scale packaging</subject><subject>Electronic equipment testing</subject><subject>Electronics packaging</subject><subject>Hardware</subject><subject>Intelligent sensors</subject><subject>Sensor systems</subject><subject>System testing</subject><subject>Vehicles</subject><subject>Wafer scale integration</subject><isbn>9780780388215</isbn><isbn>0780388216</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2004</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotUEtLxDAYDIigrP0B4iV_oDWPNk2OUtYHLOih9yVJv9hI-qDJLvbf28UdBuYyMzCD0CMlBaVEPe-_2qZghJQF5UoILm5QpmpJNnIpGa3uUBbjD9nAVSkqdY9i2wPu4AxhmgcYE54c1jhBTPgMvbcBsJsWrOc5eKuTn8aI_Yj1YPzFDQFsWqbRWxzXmGCI-BT9-L2FlxWnfrO6AL_ebD3xZGJadIIHdOt0iJBddYfa133bvOeHz7eP5uWQe1pXKe9ITZwmFTUVMfIyo7PWEV4rXlIjgbnSKMWodLYSzDlKAYjQJSu1cprxHXr6r_UAcJwXP-hlPV6f4X-ty1uz</recordid><startdate>2004</startdate><enddate>2004</enddate><creator>Majeed, B.</creator><creator>Delaney, K.</creator><creator>Barton, J.</creator><creator>Razeeb, K.M.</creator><creator>MacCarthy, N.</creator><creator>O'mathuna, C.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2004</creationdate><title>The development of a test vehicle for applications in ambient electronic systems using very thin flexible substrate</title><author>Majeed, B. ; Delaney, K. ; Barton, J. ; Razeeb, K.M. ; MacCarthy, N. ; O'mathuna, C.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-d070fa051b50b87807dccf0379341b8e2f4b99218fc562ff11ee06a424a9fa23</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Assembly</topic><topic>Chip scale packaging</topic><topic>Electronic equipment testing</topic><topic>Electronics packaging</topic><topic>Hardware</topic><topic>Intelligent sensors</topic><topic>Sensor systems</topic><topic>System testing</topic><topic>Vehicles</topic><topic>Wafer scale integration</topic><toplevel>online_resources</toplevel><creatorcontrib>Majeed, B.</creatorcontrib><creatorcontrib>Delaney, K.</creatorcontrib><creatorcontrib>Barton, J.</creatorcontrib><creatorcontrib>Razeeb, K.M.</creatorcontrib><creatorcontrib>MacCarthy, N.</creatorcontrib><creatorcontrib>O'mathuna, C.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Majeed, B.</au><au>Delaney, K.</au><au>Barton, J.</au><au>Razeeb, K.M.</au><au>MacCarthy, N.</au><au>O'mathuna, C.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The development of a test vehicle for applications in ambient electronic systems using very thin flexible substrate</atitle><btitle>Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)</btitle><stitle>EPTC</stitle><date>2004</date><risdate>2004</risdate><spage>369</spage><epage>374</epage><pages>369-374</pages><isbn>9780780388215</isbn><isbn>0780388216</isbn><abstract>In this work the development and characterisation of a very thin flexible substrate, with thickness ranging from 3 microns to 25 microns, was presented. The work analyses the stress generated in thin flexible substrate and determines the critical thickness to avoid wrinkling in the substrate. This substrate is then used to package test chips into a highly miniaturised 3D module. The 3D module consists of 4 IC's each having thickness of 50 microns and total module is approximately 450 microns in thickness and with a footprint of 18/spl times/7mm/sup 2/. This module is being developed as a technological demonstrator for the "I-Seed". The I-seed is an NMRC envisioned distributed autonomous micromodule that would interact, respond and learn from its surroundings making integration of engineering, computer science and human intelligence a reality.</abstract><pub>IEEE</pub><doi>10.1109/EPTC.2004.1396636</doi><tpages>6</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 9780780388215 |
| ispartof | Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004, p.369-374 |
| issn | |
| language | eng |
| recordid | cdi_ieee_primary_1396636 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Assembly Chip scale packaging Electronic equipment testing Electronics packaging Hardware Intelligent sensors Sensor systems System testing Vehicles Wafer scale integration |
| title | The development of a test vehicle for applications in ambient electronic systems using very thin flexible substrate |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-20T21%3A23%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=The%20development%20of%20a%20test%20vehicle%20for%20applications%20in%20ambient%20electronic%20systems%20using%20very%20thin%20flexible%20substrate&rft.btitle=Proceedings%20of%206th%20Electronics%20Packaging%20Technology%20Conference%20(EPTC%202004)%20(IEEE%20Cat.%20No.04EX971)&rft.au=Majeed,%20B.&rft.date=2004&rft.spage=369&rft.epage=374&rft.pages=369-374&rft.isbn=9780780388215&rft.isbn_list=0780388216&rft_id=info:doi/10.1109/EPTC.2004.1396636&rft_dat=%3Cieee_6IE%3E1396636%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1396636&rfr_iscdi=true |