Thermal contact resistance of cured gel polymeric thermal interface material

This paper reports the experimental results on the contact resistance of curable polymer gel thermal interface materials (TIMs) that have different mechanical properties due to difference in the rheology of the polymers. A semi-analytical model for the prediction of the thermal contact resistance of...

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Veröffentlicht in:	IEEE transactions on components and packaging technologies 2004-12, Vol.27 (4), p.702-709
Hauptverfasser:	Prasher, R.S., Matayabas, J.C.
Format:	Artikel
Sprache:	eng
Schlagworte:	Contact resistance Curable polymer gel Electrical resistance measurement flip-chip packages Greases Guidelines Heat transfer Loss measurement Mathematical models Mechanical factors Performance loss Polymer gels Predictive models Rheology Shear modulus Thermal contact resistance Thermal cycling thermal interface materials (TIMs) Thermal resistance Thermal stresses
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