Thermal contact resistance of cured gel polymeric thermal interface material
This paper reports the experimental results on the contact resistance of curable polymer gel thermal interface materials (TIMs) that have different mechanical properties due to difference in the rheology of the polymers. A semi-analytical model for the prediction of the thermal contact resistance of...
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| Veröffentlicht in: | IEEE transactions on components and packaging technologies 2004-12, Vol.27 (4), p.702-709 |
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| container_title | IEEE transactions on components and packaging technologies |
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| creator | Prasher, R.S. Matayabas, J.C. |
| description | This paper reports the experimental results on the contact resistance of curable polymer gel thermal interface materials (TIMs) that have different mechanical properties due to difference in the rheology of the polymers. A semi-analytical model for the prediction of the thermal contact resistance of cured gel TIMs is also introduced in this paper. A novel method of finding the transition from grease type behavior to gel type behavior, which is very important for post reliability stress performance, based on G' (storage shear modulus) and G'' (loss shear modulus) measurements is reported. Further, post thermal cycling thermal resistance degradation rate of gel TIMs are related to the ratio of G and G''. Finally, design guidelines for gel TIMs for use in flip-chip packages comprising heat spreaders are proposed. |
| doi_str_mv | 10.1109/TCAPT.2004.838883 |
| format | Article |
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A semi-analytical model for the prediction of the thermal contact resistance of cured gel TIMs is also introduced in this paper. A novel method of finding the transition from grease type behavior to gel type behavior, which is very important for post reliability stress performance, based on G' (storage shear modulus) and G'' (loss shear modulus) measurements is reported. Further, post thermal cycling thermal resistance degradation rate of gel TIMs are related to the ratio of G and G''. Finally, design guidelines for gel TIMs for use in flip-chip packages comprising heat spreaders are proposed.</description><identifier>ISSN: 1521-3331</identifier><identifier>EISSN: 1557-9972</identifier><identifier>DOI: 10.1109/TCAPT.2004.838883</identifier><identifier>CODEN: ITCPFB</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Contact resistance ; Curable polymer gel ; Electrical resistance measurement ; flip-chip packages ; Greases ; Guidelines ; Heat transfer ; Loss measurement ; Mathematical models ; Mechanical factors ; Performance loss ; Polymer gels ; Predictive models ; Rheology ; Shear modulus ; Thermal contact resistance ; Thermal cycling ; thermal interface materials (TIMs) ; Thermal resistance ; Thermal stresses</subject><ispartof>IEEE transactions on components and packaging technologies, 2004-12, Vol.27 (4), p.702-709</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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A semi-analytical model for the prediction of the thermal contact resistance of cured gel TIMs is also introduced in this paper. A novel method of finding the transition from grease type behavior to gel type behavior, which is very important for post reliability stress performance, based on G' (storage shear modulus) and G'' (loss shear modulus) measurements is reported. Further, post thermal cycling thermal resistance degradation rate of gel TIMs are related to the ratio of G and G''. Finally, design guidelines for gel TIMs for use in flip-chip packages comprising heat spreaders are proposed.</description><subject>Contact resistance</subject><subject>Curable polymer gel</subject><subject>Electrical resistance measurement</subject><subject>flip-chip packages</subject><subject>Greases</subject><subject>Guidelines</subject><subject>Heat transfer</subject><subject>Loss measurement</subject><subject>Mathematical models</subject><subject>Mechanical factors</subject><subject>Performance loss</subject><subject>Polymer gels</subject><subject>Predictive models</subject><subject>Rheology</subject><subject>Shear modulus</subject><subject>Thermal contact resistance</subject><subject>Thermal cycling</subject><subject>thermal interface materials (TIMs)</subject><subject>Thermal resistance</subject><subject>Thermal stresses</subject><issn>1521-3331</issn><issn>1557-9972</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqF0TtLxEAQB_AgCp6PDyA2wUKrnDs72Vcphy840OKsl81mopE8zt2k8Nub8w4EC612it9_YPafJGfA5gDMXK8WN8-rOWcsn2vUWuNeMgMhVGaM4vubmUOGiHCYHMX4zhjkOjezZLl6o9C6JvV9Nzg_pIFiHQfXeUr7KvVjoDJ9pSZd981nS6H26bBL1N1AoXITbN001a45SQ4q10Q63b3Hycvd7WrxkC2f7h8XN8vMo5ZDZrTIXSlFqQlKIC4Kiargnhy6kntUeVGo0oMCI7DMjapKJxRIUzHUYAo8Tq62e9eh_xgpDrato6emcR31Y7TaSI6MS5jk5Z-SG4WGafwfaimUEht48Qu-92PopnPt9OuaSw1qQrBFPvQxBqrsOtStC58WmN30Zb_7spu-7LavKXO-zdRE9ONRcs1y_AKUg5DY</recordid><startdate>20041201</startdate><enddate>20041201</enddate><creator>Prasher, R.S.</creator><creator>Matayabas, J.C.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>7TB</scope><scope>FR3</scope><scope>F28</scope></search><sort><creationdate>20041201</creationdate><title>Thermal contact resistance of cured gel polymeric thermal interface material</title><author>Prasher, R.S. ; Matayabas, J.C.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c386t-9854ad65d8e1d1e25b637b2cea3ad2c374bb7dc171953d497fda57169f03819b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Contact resistance</topic><topic>Curable polymer gel</topic><topic>Electrical resistance measurement</topic><topic>flip-chip packages</topic><topic>Greases</topic><topic>Guidelines</topic><topic>Heat transfer</topic><topic>Loss measurement</topic><topic>Mathematical models</topic><topic>Mechanical factors</topic><topic>Performance loss</topic><topic>Polymer gels</topic><topic>Predictive models</topic><topic>Rheology</topic><topic>Shear modulus</topic><topic>Thermal contact resistance</topic><topic>Thermal cycling</topic><topic>thermal interface materials (TIMs)</topic><topic>Thermal resistance</topic><topic>Thermal stresses</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Prasher, R.S.</creatorcontrib><creatorcontrib>Matayabas, J.C.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><jtitle>IEEE transactions on components and packaging technologies</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Prasher, R.S.</au><au>Matayabas, J.C.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Thermal contact resistance of cured gel polymeric thermal interface material</atitle><jtitle>IEEE transactions on components and packaging technologies</jtitle><stitle>TCAPT</stitle><date>2004-12-01</date><risdate>2004</risdate><volume>27</volume><issue>4</issue><spage>702</spage><epage>709</epage><pages>702-709</pages><issn>1521-3331</issn><eissn>1557-9972</eissn><coden>ITCPFB</coden><abstract>This paper reports the experimental results on the contact resistance of curable polymer gel thermal interface materials (TIMs) that have different mechanical properties due to difference in the rheology of the polymers. A semi-analytical model for the prediction of the thermal contact resistance of cured gel TIMs is also introduced in this paper. A novel method of finding the transition from grease type behavior to gel type behavior, which is very important for post reliability stress performance, based on G' (storage shear modulus) and G'' (loss shear modulus) measurements is reported. Further, post thermal cycling thermal resistance degradation rate of gel TIMs are related to the ratio of G and G''. Finally, design guidelines for gel TIMs for use in flip-chip packages comprising heat spreaders are proposed.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TCAPT.2004.838883</doi><tpages>8</tpages></addata></record> |
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| ispartof | IEEE transactions on components and packaging technologies, 2004-12, Vol.27 (4), p.702-709 |
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| source | IEEE Electronic Library (IEL) |
| subjects | Contact resistance Curable polymer gel Electrical resistance measurement flip-chip packages Greases Guidelines Heat transfer Loss measurement Mathematical models Mechanical factors Performance loss Polymer gels Predictive models Rheology Shear modulus Thermal contact resistance Thermal cycling thermal interface materials (TIMs) Thermal resistance Thermal stresses |
| title | Thermal contact resistance of cured gel polymeric thermal interface material |
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