Development of high power QFN package

Leadframe CSP package had been well known to be a superior choice for high-speed application where high thermal performance is desired. With the advancement in technology trend, there is more increasing demand for higher thermal performance in miniature package to dissipate heat and improve the devi...

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Bibliographische Detailangaben
Hauptverfasser:	Poh KS, F., Tan Hien Boon, Krishnamoorthi Sivalingam, Lim Beng Kuan, Sun, A.Y.S., Rahamat Bidin
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Assembly Bonding Chip scale packaging Costs Design. Technologies. Operation analysis. Testing Electronic packaging thermal management Electronics Exact sciences and technology Integrated circuit packaging Integrated circuits Lead Materials testing Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon Thermal resistance
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