Gold wire bonding on low-k material: a new challenge for interconnection technology

The gold wire bond technology is still widely used in back end assembly. Even for conventional devices the wire bond technology applies mechanical stress on the bond pad and substrate layers, which leads to known damages like cratering and oxide cracks. The parameter combination of ultrasonic power...

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Bibliographische Detailangaben
Hauptverfasser:	Binner, R., Schopper, A., Castaneda, J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aluminum Applied sciences Bonding forces Conducting materials Copper Delay Design. Technologies. Operation analysis. Testing Dielectric constant Dielectric materials Electronics Exact sciences and technology Gold Integrated circuit interconnections Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Wire
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