Phase change materials as a viable thermal interface material for high-power electronic applications
Phase change materials (PCMs) are an attractive alternative to thermal greases/pads. While their thermal conductivity is not as good as greases, they are more manufacturable. This paper reports on evaluation of PCMs for high power electronic applications. Conductivity measurements were carried out f...
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| creator | Ramaswamy, C. Shinde, S. Pompeo, F. Sablinski, W. Bradley, S. |
| description | Phase change materials (PCMs) are an attractive alternative to thermal greases/pads. While their thermal conductivity is not as good as greases, they are more manufacturable. This paper reports on evaluation of PCMs for high power electronic applications. Conductivity measurements were carried out for several OEM PCMs. In addition experiments were carried out to determine process parameters (to attain target thermal impedance). A few candidates were then evaluated in a single chip module, under different environmental stresses and the results are presented here. The design concept was then extended to an MCM test vehicle and two candidate PCMs were evaluated. Differences in the reliability performance between SCM and MCM form factor are explained. |
| doi_str_mv | 10.1109/ITHERM.2004.1318354 |
| format | Conference Proceeding |
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Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Impedance</subject><subject>Manufacturing</subject><subject>Phase change materials</subject><subject>Power electronics</subject><subject>Power electronics, power supplies</subject><subject>Testing</subject><subject>Thermal conductivity</subject><subject>Thermal stresses</subject><subject>Vehicles</subject><isbn>9780780383579</isbn><isbn>0780383575</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2004</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFkFFLwzAUhQMiKLO_YC958bEzaZK1eZQx3WCiyHwet7c3a6RrS1IU_72BDXY5cLmcjwP3MDaXYiGlsE_b_Wb9-bYohNALqWSljL5hmS0rkaTSWdo7lsX4LdJoowtR3rPmo4VIHFvoj8RPMFHw0EUOSfzHQ90Rn1oKJ-i475PrAK8cd0PgrT-2-Tj8UuDUEU5h6D1yGMfOI0x-6OMDu3UplLLLnrGvl_V-tcl376_b1fMuRyXklLuyaoSpRdPUVhpUYJwoCrQSSDSkUFaoBRnShUWn0xOusfWyXCpJChRoNWOP59wRIkLnAvTo42EM_gTh7yBTD5UpTOLmZ84T0dU-d6b-ASfeY4I</recordid><startdate>2004</startdate><enddate>2004</enddate><creator>Ramaswamy, C.</creator><creator>Shinde, S.</creator><creator>Pompeo, F.</creator><creator>Sablinski, W.</creator><creator>Bradley, S.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope><scope>IQODW</scope></search><sort><creationdate>2004</creationdate><title>Phase change materials as a viable thermal interface material for high-power electronic applications</title><author>Ramaswamy, C. ; Shinde, S. ; Pompeo, F. ; Sablinski, W. ; Bradley, S.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c301t-f78d05b0ddb915c3a5f022c91ae0de3c18c40e5e429cf4000fd9b67631e3a3a43</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Applied sciences</topic><topic>Conducting materials</topic><topic>Conductivity measurement</topic><topic>Electrical engineering. Electrical power engineering</topic><topic>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Impedance</topic><topic>Manufacturing</topic><topic>Phase change materials</topic><topic>Power electronics</topic><topic>Power electronics, power supplies</topic><topic>Testing</topic><topic>Thermal conductivity</topic><topic>Thermal stresses</topic><topic>Vehicles</topic><toplevel>online_resources</toplevel><creatorcontrib>Ramaswamy, C.</creatorcontrib><creatorcontrib>Shinde, S.</creatorcontrib><creatorcontrib>Pompeo, F.</creatorcontrib><creatorcontrib>Sablinski, W.</creatorcontrib><creatorcontrib>Bradley, S.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE/IET Electronic Library</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection><collection>Pascal-Francis</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ramaswamy, C.</au><au>Shinde, S.</au><au>Pompeo, F.</au><au>Sablinski, W.</au><au>Bradley, S.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Phase change materials as a viable thermal interface material for high-power electronic applications</atitle><btitle>2004 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems</btitle><stitle>ITHERM</stitle><date>2004</date><risdate>2004</risdate><volume>2</volume><spage>687</spage><epage>691 Vol.2</epage><pages>687-691 Vol.2</pages><isbn>9780780383579</isbn><isbn>0780383575</isbn><abstract>Phase change materials (PCMs) are an attractive alternative to thermal greases/pads. While their thermal conductivity is not as good as greases, they are more manufacturable. This paper reports on evaluation of PCMs for high power electronic applications. Conductivity measurements were carried out for several OEM PCMs. In addition experiments were carried out to determine process parameters (to attain target thermal impedance). A few candidates were then evaluated in a single chip module, under different environmental stresses and the results are presented here. The design concept was then extended to an MCM test vehicle and two candidate PCMs were evaluated. Differences in the reliability performance between SCM and MCM form factor are explained.</abstract><cop>Piscataway NJ</cop><pub>IEEE</pub><doi>10.1109/ITHERM.2004.1318354</doi></addata></record> |
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| identifier | ISBN: 9780780383579 |
| ispartof | 2004 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, Vol.2, p.687-691 Vol.2 |
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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Applied sciences Conducting materials Conductivity measurement Electrical engineering. Electrical power engineering Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Impedance Manufacturing Phase change materials Power electronics Power electronics, power supplies Testing Thermal conductivity Thermal stresses Vehicles |
| title | Phase change materials as a viable thermal interface material for high-power electronic applications |
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