The evaluation of the new composite lead free solders with the novel fabricating process
With the development of surface mount technology, especially for optical and optoelectronic devices, solders having improved mechanical properties are required for application that demand high reliability and dimensional stability. Using composite solders, by the addition of reinforcement particles...
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| creator | Wang, L. Yu, D.Q. Han, S.Q. Ma, H.T. Xie, H.P. |
| description | With the development of surface mount technology, especially for optical and optoelectronic devices, solders having improved mechanical properties are required for application that demand high reliability and dimensional stability. Using composite solders, by the addition of reinforcement particles to a conventional solder alloy, is an attractive potential method to enhance the mechanical properties. Recently, we developed a new process to fabricate composite lead free solders. 3%, 5%, and 10% weigh percentage of Y/sub 2/O/sub 3/ rare earth oxides were milled with RMA flux and then Sn-3Ag-0.5Cu powders were added, to form a new solder paste. The microstructures of the new composite solders are investigated and it is proved that with this new process, the reinforcement particles disperse in the solder quite finely and the addition of 3% and 5% rare earth oxides increases the shear strength of the solder joints dramatically, while 10% addition decreased the strength. At the same time, the addition does no harm to the wetting properties. |
| doi_str_mv | 10.1109/BEPRL.2004.1308149 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1308149</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1308149</ieee_id><sourcerecordid>1308149</sourcerecordid><originalsourceid>FETCH-LOGICAL-i173t-ced16a78bc2fdb1555be1d777b17b32f0bf552f28101ea9f8ccbe1449ed71a7a3</originalsourceid><addsrcrecordid>eNotj11LwzAYhQMiKLN_QG_yB1rzNm2TXOqYHzBQZIJ3Ix9vXKRrSlI3_PcWtsOBA4eHA4eQW2AVAFP3j6v3j3VVM9ZUwJmERl2QQgnJZnPJO-iuSJHzD5vFFe8EvyZfmx1SPOj-V08hDjR6Os3NgEdq436MOUxIe9SO-oRIc-wdpkyPYdqdwHjAnnptUrDzwvBNxxQt5nxDLr3uMxbnXJDPp9Vm-VKu355flw_rMoDgU2nRQaeFNLb2zkDbtgbBCSEMCMNrz4xv29rXEhigVl5aOwNNo9AJ0ELzBbk77QZE3I4p7HX6257_83-T4lJ0</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>The evaluation of the new composite lead free solders with the novel fabricating process</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Wang, L. ; Yu, D.Q. ; Han, S.Q. ; Ma, H.T. ; Xie, H.P.</creator><creatorcontrib>Wang, L. ; Yu, D.Q. ; Han, S.Q. ; Ma, H.T. ; Xie, H.P.</creatorcontrib><description>With the development of surface mount technology, especially for optical and optoelectronic devices, solders having improved mechanical properties are required for application that demand high reliability and dimensional stability. Using composite solders, by the addition of reinforcement particles to a conventional solder alloy, is an attractive potential method to enhance the mechanical properties. Recently, we developed a new process to fabricate composite lead free solders. 3%, 5%, and 10% weigh percentage of Y/sub 2/O/sub 3/ rare earth oxides were milled with RMA flux and then Sn-3Ag-0.5Cu powders were added, to form a new solder paste. The microstructures of the new composite solders are investigated and it is proved that with this new process, the reinforcement particles disperse in the solder quite finely and the addition of 3% and 5% rare earth oxides increases the shear strength of the solder joints dramatically, while 10% addition decreased the strength. At the same time, the addition does no harm to the wetting properties.</description><identifier>ISBN: 9780780383616</identifier><identifier>ISBN: 0780383613</identifier><identifier>DOI: 10.1109/BEPRL.2004.1308149</identifier><language>eng</language><publisher>IEEE</publisher><subject>Environmentally friendly manufacturing techniques ; Lead compounds ; Mechanical factors ; Microstructure ; Optical devices ; Optoelectronic devices ; Powders ; Soldering ; Stability ; Surface-mount technology</subject><ispartof>Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809), 2004, p.50-56</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1308149$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2056,4048,4049,27924,54919</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1308149$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Wang, L.</creatorcontrib><creatorcontrib>Yu, D.Q.</creatorcontrib><creatorcontrib>Han, S.Q.</creatorcontrib><creatorcontrib>Ma, H.T.</creatorcontrib><creatorcontrib>Xie, H.P.</creatorcontrib><title>The evaluation of the new composite lead free solders with the novel fabricating process</title><title>Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)</title><addtitle>BEPRL</addtitle><description>With the development of surface mount technology, especially for optical and optoelectronic devices, solders having improved mechanical properties are required for application that demand high reliability and dimensional stability. Using composite solders, by the addition of reinforcement particles to a conventional solder alloy, is an attractive potential method to enhance the mechanical properties. Recently, we developed a new process to fabricate composite lead free solders. 3%, 5%, and 10% weigh percentage of Y/sub 2/O/sub 3/ rare earth oxides were milled with RMA flux and then Sn-3Ag-0.5Cu powders were added, to form a new solder paste. The microstructures of the new composite solders are investigated and it is proved that with this new process, the reinforcement particles disperse in the solder quite finely and the addition of 3% and 5% rare earth oxides increases the shear strength of the solder joints dramatically, while 10% addition decreased the strength. At the same time, the addition does no harm to the wetting properties.</description><subject>Environmentally friendly manufacturing techniques</subject><subject>Lead compounds</subject><subject>Mechanical factors</subject><subject>Microstructure</subject><subject>Optical devices</subject><subject>Optoelectronic devices</subject><subject>Powders</subject><subject>Soldering</subject><subject>Stability</subject><subject>Surface-mount technology</subject><isbn>9780780383616</isbn><isbn>0780383613</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2004</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj11LwzAYhQMiKLN_QG_yB1rzNm2TXOqYHzBQZIJ3Ix9vXKRrSlI3_PcWtsOBA4eHA4eQW2AVAFP3j6v3j3VVM9ZUwJmERl2QQgnJZnPJO-iuSJHzD5vFFe8EvyZfmx1SPOj-V08hDjR6Os3NgEdq436MOUxIe9SO-oRIc-wdpkyPYdqdwHjAnnptUrDzwvBNxxQt5nxDLr3uMxbnXJDPp9Vm-VKu355flw_rMoDgU2nRQaeFNLb2zkDbtgbBCSEMCMNrz4xv29rXEhigVl5aOwNNo9AJ0ELzBbk77QZE3I4p7HX6257_83-T4lJ0</recordid><startdate>2004</startdate><enddate>2004</enddate><creator>Wang, L.</creator><creator>Yu, D.Q.</creator><creator>Han, S.Q.</creator><creator>Ma, H.T.</creator><creator>Xie, H.P.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2004</creationdate><title>The evaluation of the new composite lead free solders with the novel fabricating process</title><author>Wang, L. ; Yu, D.Q. ; Han, S.Q. ; Ma, H.T. ; Xie, H.P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i173t-ced16a78bc2fdb1555be1d777b17b32f0bf552f28101ea9f8ccbe1449ed71a7a3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Environmentally friendly manufacturing techniques</topic><topic>Lead compounds</topic><topic>Mechanical factors</topic><topic>Microstructure</topic><topic>Optical devices</topic><topic>Optoelectronic devices</topic><topic>Powders</topic><topic>Soldering</topic><topic>Stability</topic><topic>Surface-mount technology</topic><toplevel>online_resources</toplevel><creatorcontrib>Wang, L.</creatorcontrib><creatorcontrib>Yu, D.Q.</creatorcontrib><creatorcontrib>Han, S.Q.</creatorcontrib><creatorcontrib>Ma, H.T.</creatorcontrib><creatorcontrib>Xie, H.P.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wang, L.</au><au>Yu, D.Q.</au><au>Han, S.Q.</au><au>Ma, H.T.</au><au>Xie, H.P.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The evaluation of the new composite lead free solders with the novel fabricating process</atitle><btitle>Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)</btitle><stitle>BEPRL</stitle><date>2004</date><risdate>2004</risdate><spage>50</spage><epage>56</epage><pages>50-56</pages><isbn>9780780383616</isbn><isbn>0780383613</isbn><abstract>With the development of surface mount technology, especially for optical and optoelectronic devices, solders having improved mechanical properties are required for application that demand high reliability and dimensional stability. Using composite solders, by the addition of reinforcement particles to a conventional solder alloy, is an attractive potential method to enhance the mechanical properties. Recently, we developed a new process to fabricate composite lead free solders. 3%, 5%, and 10% weigh percentage of Y/sub 2/O/sub 3/ rare earth oxides were milled with RMA flux and then Sn-3Ag-0.5Cu powders were added, to form a new solder paste. The microstructures of the new composite solders are investigated and it is proved that with this new process, the reinforcement particles disperse in the solder quite finely and the addition of 3% and 5% rare earth oxides increases the shear strength of the solder joints dramatically, while 10% addition decreased the strength. At the same time, the addition does no harm to the wetting properties.</abstract><pub>IEEE</pub><doi>10.1109/BEPRL.2004.1308149</doi><tpages>7</tpages></addata></record> |
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| ispartof | Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809), 2004, p.50-56 |
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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Environmentally friendly manufacturing techniques Lead compounds Mechanical factors Microstructure Optical devices Optoelectronic devices Powders Soldering Stability Surface-mount technology |
| title | The evaluation of the new composite lead free solders with the novel fabricating process |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T01%3A16%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=The%20evaluation%20of%20the%20new%20composite%20lead%20free%20solders%20with%20the%20novel%20fabricating%20process&rft.btitle=Proceedings%20of%202004%20International%20Conference%20on%20the%20Business%20of%20Electronic%20Product%20Reliability%20and%20Liability%20(IEEE%20Cat.%20No.04EX809)&rft.au=Wang,%20L.&rft.date=2004&rft.spage=50&rft.epage=56&rft.pages=50-56&rft.isbn=9780780383616&rft.isbn_list=0780383613&rft_id=info:doi/10.1109/BEPRL.2004.1308149&rft_dat=%3Cieee_6IE%3E1308149%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1308149&rfr_iscdi=true |