Reliability-based design optimization for land grid array solder joints under thermo-mechanical load

This paper presents a reliability-based design optimization methodology for second level electronic package solder joints. The reliability-based design optimization aims to find the most robust as well as effective design in the possible design space. In this paper, the reliability-based design opti...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Zhen Xue Han, Xu, L., Ren Wei, Bo Ping Wang, Reinikamen, T.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Constraint optimization Design optimization Electronic packaging thermal management Finite element methods Performance analysis Response surface methodology Robustness Soldering System performance Thermomechanical processes
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