The study on pad of AlN multilayer cofire ceramic substrate
Aluminum nitride (AlN) has been considered as a material for ceramic packages in the semiconductor industry toward higher speed, power dissipation and packaging density. A tungsten pad paste is proposed with Ni as additive for cofire multi-layer ceramic substrate. If 0.3%wt Ni is added in the pad pa...
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| creator | Hu Yongda Jiang Ming Yang Bangchao Zhang Hao Cui Song Zhang Jingguo |
| description | Aluminum nitride (AlN) has been considered as a material for ceramic packages in the semiconductor industry toward higher speed, power dissipation and packaging density. A tungsten pad paste is proposed with Ni as additive for cofire multi-layer ceramic substrate. If 0.3%wt Ni is added in the pad paste, the paste and AlN tape have suitable shrinkage match. The sheet resistance is 10m /spl Omega///spl square/, substrate warp is less than 30 /spl mu/m/50mm and adhesion strength is greater than 42MPa. |
| doi_str_mv | 10.1109/EPTC.2003.1298755 |
| format | Conference Proceeding |
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A tungsten pad paste is proposed with Ni as additive for cofire multi-layer ceramic substrate. If 0.3%wt Ni is added in the pad paste, the paste and AlN tape have suitable shrinkage match. The sheet resistance is 10m /spl Omega///spl square/, substrate warp is less than 30 /spl mu/m/50mm and adhesion strength is greater than 42MPa.</description><identifier>ISBN: 0780381688</identifier><identifier>ISBN: 9780780381681</identifier><identifier>DOI: 10.1109/EPTC.2003.1298755</identifier><language>eng</language><publisher>IEEE</publisher><subject>Aluminum nitride ; Ceramics ; Electronics industry ; Nonhomogeneous media ; Power dissipation ; Semiconductor device packaging ; Semiconductor materials ; Sheet materials ; Substrates ; Tungsten</subject><ispartof>Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. 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The sheet resistance is 10m /spl Omega///spl square/, substrate warp is less than 30 /spl mu/m/50mm and adhesion strength is greater than 42MPa.</description><subject>Aluminum nitride</subject><subject>Ceramics</subject><subject>Electronics industry</subject><subject>Nonhomogeneous media</subject><subject>Power dissipation</subject><subject>Semiconductor device packaging</subject><subject>Semiconductor materials</subject><subject>Sheet materials</subject><subject>Substrates</subject><subject>Tungsten</subject><isbn>0780381688</isbn><isbn>9780780381681</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2003</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj8tKxDAUQAMiqON8gLjJD7Tm3RtcDWV8wKAuuh_S5gYjrR2SdNG_d8A5m7M7cAh54KzmnNmn_VfX1oIxWXNhodH6ityxBpgEbgBuyDbnH3ZGWmWUuiXP3TfSXBa_0vmXnpync6C78YNOy1ji6FZMdJhDTEgHTG6KA81Ln0tyBe_JdXBjxu3FG9K97Lv2rTp8vr63u0MVLStVLxqmgucaUXCGhhvRB9urAN4NFjxq6cEDeOasVtwb1QTQRgY4Hygu5IY8_mcjIh5PKU4urcfLnvwDt_VE7A</recordid><startdate>2003</startdate><enddate>2003</enddate><creator>Hu Yongda</creator><creator>Jiang Ming</creator><creator>Yang Bangchao</creator><creator>Zhang Hao</creator><creator>Cui Song</creator><creator>Zhang Jingguo</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2003</creationdate><title>The study on pad of AlN multilayer cofire ceramic substrate</title><author>Hu Yongda ; Jiang Ming ; Yang Bangchao ; Zhang Hao ; Cui Song ; Zhang Jingguo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-b2704fd15ee210e6162bf9b4f8dac98de53d8d88d0a9541d647f8563f81294123</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Aluminum nitride</topic><topic>Ceramics</topic><topic>Electronics industry</topic><topic>Nonhomogeneous media</topic><topic>Power dissipation</topic><topic>Semiconductor device packaging</topic><topic>Semiconductor materials</topic><topic>Sheet materials</topic><topic>Substrates</topic><topic>Tungsten</topic><toplevel>online_resources</toplevel><creatorcontrib>Hu Yongda</creatorcontrib><creatorcontrib>Jiang Ming</creatorcontrib><creatorcontrib>Yang Bangchao</creatorcontrib><creatorcontrib>Zhang Hao</creatorcontrib><creatorcontrib>Cui Song</creatorcontrib><creatorcontrib>Zhang Jingguo</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hu Yongda</au><au>Jiang Ming</au><au>Yang Bangchao</au><au>Zhang Hao</au><au>Cui Song</au><au>Zhang Jingguo</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The study on pad of AlN multilayer cofire ceramic substrate</atitle><btitle>Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. 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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Aluminum nitride Ceramics Electronics industry Nonhomogeneous media Power dissipation Semiconductor device packaging Semiconductor materials Sheet materials Substrates Tungsten |
| title | The study on pad of AlN multilayer cofire ceramic substrate |
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