The study on pad of AlN multilayer cofire ceramic substrate

The study on pad of AlN multilayer cofire ceramic substrate

Aluminum nitride (AlN) has been considered as a material for ceramic packages in the semiconductor industry toward higher speed, power dissipation and packaging density. A tungsten pad paste is proposed with Ni as additive for cofire multi-layer ceramic substrate. If 0.3%wt Ni is added in the pad pa...

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Bibliographische Detailangaben
Hauptverfasser: Hu Yongda, Jiang Ming, Yang Bangchao, Zhang Hao, Cui Song, Zhang Jingguo
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Aluminum nitride
Ceramics
Electronics industry
Nonhomogeneous media
Power dissipation
Semiconductor device packaging
Semiconductor materials
Sheet materials
Substrates
Tungsten
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Zusammenfassung:Aluminum nitride (AlN) has been considered as a material for ceramic packages in the semiconductor industry toward higher speed, power dissipation and packaging density. A tungsten pad paste is proposed with Ni as additive for cofire multi-layer ceramic substrate. If 0.3%wt Ni is added in the pad paste, the paste and AlN tape have suitable shrinkage match. The sheet resistance is 10m /spl Omega///spl square/, substrate warp is less than 30 /spl mu/m/50mm and adhesion strength is greater than 42MPa.
DOI:10.1109/EPTC.2003.1298755