The brazing of metal-ceramic insulator package
With the development of the IC technology, the metal-ceramic insulator package is widely used in IC packaging and gradually develop a series of products, which play an important role in package field. Despite the type of the package differ from each other, the basic structure is same. A metal-cerami...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 205 |
|---|---|
| container_issue | |
| container_start_page | 204 |
| container_title | |
| container_volume | |
| creator | Wangchen Tu Chuanzhen Chen Kai Wangluning |
| description | With the development of the IC technology, the metal-ceramic insulator package is widely used in IC packaging and gradually develop a series of products, which play an important role in package field. Despite the type of the package differ from each other, the basic structure is same. A metal-ceramic insulator is usually consist of a base, a frame, leads, solder and ceramic insulator which is produced by means of brazing. In following passage, it takes JF04F3 package as an example to make detailed introduction. |
| doi_str_mv | 10.1109/EPTC.2003.1298726 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1298726</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1298726</ieee_id><sourcerecordid>1298726</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-bce62cbe2340f0538f303d636f643ea4598e639a4ddc6ccc7996338bbb0287c23</originalsourceid><addsrcrecordid>eNotj8tKAzEUQAMiVGs_QNzkB2a8yc3ksZShPqCgi-m6JJmbGp1pS2Zc6Ncr2LM5uwOHsVsBtRDg7tdvXVtLAKyFdNZIfcGuwVhAK7S1C7aapg_4A53SSl2xunsnHor_yYc9PyY-0uyHKlLxY448H6avwc_Hwk8-fvo93bDL5IeJVmcv2fZx3bXP1eb16aV92FRZmGauQiQtYyCJChI0aBMC9hp10grJq8ZZ0ui86vuoY4zGOY1oQwggrYkSl-zuv5uJaHcqefTle3dewl8USEDa</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>The brazing of metal-ceramic insulator package</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Wangchen Tu ; Chuanzhen Chen ; Kai Wangluning</creator><creatorcontrib>Wangchen Tu ; Chuanzhen Chen ; Kai Wangluning</creatorcontrib><description>With the development of the IC technology, the metal-ceramic insulator package is widely used in IC packaging and gradually develop a series of products, which play an important role in package field. Despite the type of the package differ from each other, the basic structure is same. A metal-ceramic insulator is usually consist of a base, a frame, leads, solder and ceramic insulator which is produced by means of brazing. In following passage, it takes JF04F3 package as an example to make detailed introduction.</description><identifier>ISBN: 0780381688</identifier><identifier>ISBN: 9780780381681</identifier><identifier>DOI: 10.1109/EPTC.2003.1298726</identifier><language>eng</language><publisher>IEEE</publisher><subject>Ceramics ; Cooling ; Copper ; Electronics packaging ; Insulation ; Integrated circuit packaging ; Lead ; Metal-insulator structures ; Protection ; Temperature</subject><ispartof>Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003, 2003, p.204-205</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1298726$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1298726$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Wangchen Tu</creatorcontrib><creatorcontrib>Chuanzhen Chen</creatorcontrib><creatorcontrib>Kai Wangluning</creatorcontrib><title>The brazing of metal-ceramic insulator package</title><title>Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003</title><addtitle>ICEPT</addtitle><description>With the development of the IC technology, the metal-ceramic insulator package is widely used in IC packaging and gradually develop a series of products, which play an important role in package field. Despite the type of the package differ from each other, the basic structure is same. A metal-ceramic insulator is usually consist of a base, a frame, leads, solder and ceramic insulator which is produced by means of brazing. In following passage, it takes JF04F3 package as an example to make detailed introduction.</description><subject>Ceramics</subject><subject>Cooling</subject><subject>Copper</subject><subject>Electronics packaging</subject><subject>Insulation</subject><subject>Integrated circuit packaging</subject><subject>Lead</subject><subject>Metal-insulator structures</subject><subject>Protection</subject><subject>Temperature</subject><isbn>0780381688</isbn><isbn>9780780381681</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2003</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj8tKAzEUQAMiVGs_QNzkB2a8yc3ksZShPqCgi-m6JJmbGp1pS2Zc6Ncr2LM5uwOHsVsBtRDg7tdvXVtLAKyFdNZIfcGuwVhAK7S1C7aapg_4A53SSl2xunsnHor_yYc9PyY-0uyHKlLxY448H6avwc_Hwk8-fvo93bDL5IeJVmcv2fZx3bXP1eb16aV92FRZmGauQiQtYyCJChI0aBMC9hp10grJq8ZZ0ui86vuoY4zGOY1oQwggrYkSl-zuv5uJaHcqefTle3dewl8USEDa</recordid><startdate>2003</startdate><enddate>2003</enddate><creator>Wangchen Tu</creator><creator>Chuanzhen Chen</creator><creator>Kai Wangluning</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2003</creationdate><title>The brazing of metal-ceramic insulator package</title><author>Wangchen Tu ; Chuanzhen Chen ; Kai Wangluning</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-bce62cbe2340f0538f303d636f643ea4598e639a4ddc6ccc7996338bbb0287c23</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Ceramics</topic><topic>Cooling</topic><topic>Copper</topic><topic>Electronics packaging</topic><topic>Insulation</topic><topic>Integrated circuit packaging</topic><topic>Lead</topic><topic>Metal-insulator structures</topic><topic>Protection</topic><topic>Temperature</topic><toplevel>online_resources</toplevel><creatorcontrib>Wangchen Tu</creatorcontrib><creatorcontrib>Chuanzhen Chen</creatorcontrib><creatorcontrib>Kai Wangluning</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wangchen Tu</au><au>Chuanzhen Chen</au><au>Kai Wangluning</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The brazing of metal-ceramic insulator package</atitle><btitle>Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003</btitle><stitle>ICEPT</stitle><date>2003</date><risdate>2003</risdate><spage>204</spage><epage>205</epage><pages>204-205</pages><isbn>0780381688</isbn><isbn>9780780381681</isbn><abstract>With the development of the IC technology, the metal-ceramic insulator package is widely used in IC packaging and gradually develop a series of products, which play an important role in package field. Despite the type of the package differ from each other, the basic structure is same. A metal-ceramic insulator is usually consist of a base, a frame, leads, solder and ceramic insulator which is produced by means of brazing. In following passage, it takes JF04F3 package as an example to make detailed introduction.</abstract><pub>IEEE</pub><doi>10.1109/EPTC.2003.1298726</doi><tpages>2</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 0780381688 |
| ispartof | Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003, 2003, p.204-205 |
| issn | |
| language | eng |
| recordid | cdi_ieee_primary_1298726 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Ceramics Cooling Copper Electronics packaging Insulation Integrated circuit packaging Lead Metal-insulator structures Protection Temperature |
| title | The brazing of metal-ceramic insulator package |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T01%3A39%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=The%20brazing%20of%20metal-ceramic%20insulator%20package&rft.btitle=Fifth%20International%20Conference%20onElectronic%20Packaging%20Technology%20Proceedings,%202003.%20ICEPT2003&rft.au=Wangchen%20Tu&rft.date=2003&rft.spage=204&rft.epage=205&rft.pages=204-205&rft.isbn=0780381688&rft.isbn_list=9780780381681&rft_id=info:doi/10.1109/EPTC.2003.1298726&rft_dat=%3Cieee_6IE%3E1298726%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1298726&rfr_iscdi=true |