Mechanical failure strength characterization of silicon dice

Modem Integrated Circuit technology has driven the trend in die size and thickness decrease of the microelectronics circuits. High stresses induced in the die due to packaging, assembly and reliability tests begin to surface. Due to its brittle nature, moderate stresses could result in detrimental f...

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Bibliographische Detailangaben

Hauptverfasser:	Chong, D.Y.R., Lee, W.E., Pang, J.H.L., Low, T.H., Lim, B.K.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Circuit testing Integrated circuit packaging Integrated circuit reliability Integrated circuit technology Microelectronics Modems Silicon Stress Surface cracks
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