Wire bond causes electrical overstress [BGA package example]
Electrical overstress causing burnt/melt metallization is a common failure in microelectronics circuits. It can occur in the manufacturing process or at the end user. For this type of failure, most of the times, it is due to the transient voltage or surge in current spiking at the auto test equipmen...
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| creator | Tan, S.H. Kang, C.A.Y. Ong, S.H. |
| description | Electrical overstress causing burnt/melt metallization is a common failure in microelectronics circuits. It can occur in the manufacturing process or at the end user. For this type of failure, most of the times, it is due to the transient voltage or surge in current spiking at the auto test equipment (ATE) or test handler grounding. It could also be a faulty application at the customer. To nail down the problem, we need to investigate the whole manufacturing process from assembly to the final electrical testing of the devices. In this paper, the failing device was an enhanced plastic ball gate array (EPBGA) package with about 500 bonding wires. We isolated the culprit to the wire bond process via a problem solving methodology and experimental final verification. |
| doi_str_mv | 10.1109/EPTC.2003.1271547 |
| format | Conference Proceeding |
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It can occur in the manufacturing process or at the end user. For this type of failure, most of the times, it is due to the transient voltage or surge in current spiking at the auto test equipment (ATE) or test handler grounding. It could also be a faulty application at the customer. To nail down the problem, we need to investigate the whole manufacturing process from assembly to the final electrical testing of the devices. In this paper, the failing device was an enhanced plastic ball gate array (EPBGA) package with about 500 bonding wires. 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It can occur in the manufacturing process or at the end user. For this type of failure, most of the times, it is due to the transient voltage or surge in current spiking at the auto test equipment (ATE) or test handler grounding. It could also be a faulty application at the customer. To nail down the problem, we need to investigate the whole manufacturing process from assembly to the final electrical testing of the devices. In this paper, the failing device was an enhanced plastic ball gate array (EPBGA) package with about 500 bonding wires. We isolated the culprit to the wire bond process via a problem solving methodology and experimental final verification.</description><subject>Bonding</subject><subject>Circuits</subject><subject>Manufacturing processes</subject><subject>Metallization</subject><subject>Microelectronics</subject><subject>Packaging</subject><subject>Surges</subject><subject>Test equipment</subject><subject>Voltage</subject><subject>Wire</subject><isbn>9780780382053</isbn><isbn>0780382056</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2003</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj8tKAzEYhQMiKHUeQNzkBWbMPRNwU4faCgVdtHQhUnL5I9GpHZJR9O0dsIcD3-7wHYSuKWkoJeZ28bzpGkYIbyjTVAp9hiqjWzKVt4xIfoGqUt7JFG6EUvwS3e1SBuyOnwF7-1WgYOjBjzl52-PjN-QyZigFv9wv53iw_sO-AYYfexh6eL1C59H2BaoTZ2j7sNh0q3r9tHzs5us6US3HWgFoFkkQzohWa08FaykRwgERUgUWojTKOkmlixCUEhIc1VFaq3ngk_YM3fzvJgDYDzkdbP7dnz7yP_bhRk4</recordid><startdate>2003</startdate><enddate>2003</enddate><creator>Tan, S.H.</creator><creator>Kang, C.A.Y.</creator><creator>Ong, S.H.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2003</creationdate><title>Wire bond causes electrical overstress [BGA package example]</title><author>Tan, S.H. ; Kang, C.A.Y. ; Ong, S.H.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-6ee72f0d4b94877c14281044be0456d2df596ab515bfed6645eb17f5aa73d3053</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Bonding</topic><topic>Circuits</topic><topic>Manufacturing processes</topic><topic>Metallization</topic><topic>Microelectronics</topic><topic>Packaging</topic><topic>Surges</topic><topic>Test equipment</topic><topic>Voltage</topic><topic>Wire</topic><toplevel>online_resources</toplevel><creatorcontrib>Tan, S.H.</creatorcontrib><creatorcontrib>Kang, C.A.Y.</creatorcontrib><creatorcontrib>Ong, S.H.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tan, S.H.</au><au>Kang, C.A.Y.</au><au>Ong, S.H.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Wire bond causes electrical overstress [BGA package example]</atitle><btitle>Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)</btitle><stitle>EPTC</stitle><date>2003</date><risdate>2003</risdate><spage>366</spage><epage>368</epage><pages>366-368</pages><isbn>9780780382053</isbn><isbn>0780382056</isbn><abstract>Electrical overstress causing burnt/melt metallization is a common failure in microelectronics circuits. It can occur in the manufacturing process or at the end user. For this type of failure, most of the times, it is due to the transient voltage or surge in current spiking at the auto test equipment (ATE) or test handler grounding. It could also be a faulty application at the customer. To nail down the problem, we need to investigate the whole manufacturing process from assembly to the final electrical testing of the devices. In this paper, the failing device was an enhanced plastic ball gate array (EPBGA) package with about 500 bonding wires. We isolated the culprit to the wire bond process via a problem solving methodology and experimental final verification.</abstract><pub>IEEE</pub><doi>10.1109/EPTC.2003.1271547</doi><tpages>3</tpages></addata></record> |
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| subjects | Bonding Circuits Manufacturing processes Metallization Microelectronics Packaging Surges Test equipment Voltage Wire |
| title | Wire bond causes electrical overstress [BGA package example] |
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