DATE panel chips of the future: soft, crunchy or hard?

Today's electronic products are composed of an increasingly diverse set of ICs, ranging from dedicated ASICs, domain-specific ASSPs, platform FPGAs, to general-purpose FPGA's. With increasing integration, a mix of different fabrics on a single SoC becomes possible, combining ASIC-style sta...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Paulin, P.G.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Application specific processors Costs Design automation Fabrics Field programmable gate arrays Manufacturing Productivity Reduced instruction set computing Space technology Time to market
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