Flip-chip assembly and liquid crystal polymer encapsulation for variable MEMS capacitors
Packaging is a well-known barrier to the advancement of microelectromechanical systems (MEMS) for RF applications. To pave the way for the removal of this barrier, we have developed a flip-chip assembly technology to transfer foundry-fabricated MEMS devices from the host silicon substrate to a ceram...
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Veröffentlicht in: | IEEE transactions on microwave theory and techniques 2003-12, Vol.51 (12), p.2562-2567 |
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container_title | IEEE transactions on microwave theory and techniques |
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creator | Faheem, F.F. Gupta, K.C. Yung-Cheng Lee |
description | Packaging is a well-known barrier to the advancement of microelectromechanical systems (MEMS) for RF applications. To pave the way for the removal of this barrier, we have developed a flip-chip assembly technology to transfer foundry-fabricated MEMS devices from the host silicon substrate to a ceramic substrate. Specifically, posts have been designed and fabricated to assure excellent RF performance by achieving a precise gap between the device and ceramic substrate. In addition, a novel liquid crystal polymer (LCP) encapsulation technology has been developed to protect the RF MEMS device. LCP is a good encapsulation material for nonhermetic packaging because it significantly reduces the packaging cost. We have demonstrated excellent RF performance of variable MEMS capacitors that have been flip-chip assembled and LCP encapsulated. The quality (Q) factors of such capacitors were measured to be higher than 300 at 1.0 GHz. |
doi_str_mv | 10.1109/TMTT.2003.819778 |
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The quality (Q) factors of such capacitors were measured to be higher than 300 at 1.0 GHz.</description><identifier>ISSN: 0018-9480</identifier><identifier>EISSN: 1557-9670</identifier><identifier>DOI: 10.1109/TMTT.2003.819778</identifier><identifier>CODEN: IETMAB</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Assembly ; Capacitors ; Ceramics ; Devices ; Encapsulation ; Liquid crystal polymers ; Microelectromechanical devices ; Microelectromechanical systems ; Micromechanical devices ; Packaging ; Radio frequencies ; Radio frequency</subject><ispartof>IEEE transactions on microwave theory and techniques, 2003-12, Vol.51 (12), p.2562-2567</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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The quality (Q) factors of such capacitors were measured to be higher than 300 at 1.0 GHz.</description><subject>Assembly</subject><subject>Capacitors</subject><subject>Ceramics</subject><subject>Devices</subject><subject>Encapsulation</subject><subject>Liquid crystal polymers</subject><subject>Microelectromechanical devices</subject><subject>Microelectromechanical systems</subject><subject>Micromechanical devices</subject><subject>Packaging</subject><subject>Radio frequencies</subject><subject>Radio frequency</subject><issn>0018-9480</issn><issn>1557-9670</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2003</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqNkcFLwzAUxoMoOKd3wUvwoKfOlzRtkqPIpsKGByd4C2maYkbWdkkr7L-3ZYLgQTw9Hu_3fbz3PoQuCcwIAXm3Xq3XMwqQzgSRnIsjNCFZxhOZczhGEwAiEskEnKKzGDdDyzIQE_S-8K5NzIdrsY7Rbgu_x7ousXe73pXYhH3stMdt4_dbG7CtjW5j73XnmhpXTcCfOjhdeItX89UrHqbauK4J8RydVNpHe_Fdp-htMV8_PCXLl8fnh_tlYhjnXUIqk1omWFHmkFXMZMKWNqcFr7KS8EKCLkQleJqTEkBIoXleUE4zkARSylk6RbcH3zY0u97GTm1dNNZ7Xdumj0oCGT5AKB_Imz9JKjiXVJJ_gFRSAqPj9S9w0_ShHs5VQrCUsZyNC8IBMqGJMdhKtcFtddgrAmqMTo3RqTE6dYhukFwdJM5a-4PTLOcS0i-lwZPl</recordid><startdate>20031201</startdate><enddate>20031201</enddate><creator>Faheem, F.F.</creator><creator>Gupta, K.C.</creator><creator>Yung-Cheng Lee</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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subjects | Assembly Capacitors Ceramics Devices Encapsulation Liquid crystal polymers Microelectromechanical devices Microelectromechanical systems Micromechanical devices Packaging Radio frequencies Radio frequency |
title | Flip-chip assembly and liquid crystal polymer encapsulation for variable MEMS capacitors |
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