Innovation ultra thin packaging for RF-MEMS devices

In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes for vertical feed-through were fabricated on the thin silicon wafer by we...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yun-Kwon Park, Yong-Kook Kim, Chul-Ju Kim, Byeong-Kwon Ju, Jong-Oh Park
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Chemical processes Chemical technology Gold Optical reflection Packaging Radio frequency Radiofrequency microelectromechanical systems Silicon Technological innovation Wafer bonding
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