Thermal crosstalk in a group of pyroelectric sensitive elements for thermal imaging
Temperature distributions under periodical thermal excitation and the response of the thermal imaging device, composed of the group of pyroelectric sensitive elements mounted on a single silicon substrate, are presented. The sensitive element consists of a covering metal layer, infrared polymer abso...
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| Veröffentlicht in: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control ferroelectrics, and frequency control, 2003-06, Vol.50 (6), p.720-723 |
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| container_end_page | 723 |
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| container_issue | 6 |
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| container_title | IEEE transactions on ultrasonics, ferroelectrics, and frequency control |
| container_volume | 50 |
| creator | Yung Sup Yoon Samoilov, V.B. Kletsky, S.V. |
| description | Temperature distributions under periodical thermal excitation and the response of the thermal imaging device, composed of the group of pyroelectric sensitive elements mounted on a single silicon substrate, are presented. The sensitive element consists of a covering metal layer, infrared polymer absorber, front metal contact, sensitive pyroelectric element, the interconnecting column, and the bulk silicon readout. The results of numerical modeling show that the thermal crosstalk between sensitive elements to be critical especially at low frequency (f |
| doi_str_mv | 10.1109/TUFFC.2003.1209561 |
| format | Article |
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The sensitive element consists of a covering metal layer, infrared polymer absorber, front metal contact, sensitive pyroelectric element, the interconnecting column, and the bulk silicon readout. The results of numerical modeling show that the thermal crosstalk between sensitive elements to be critical especially at low frequency (f<10 Hz) of periodically modulated light.</description><identifier>ISSN: 0885-3010</identifier><identifier>EISSN: 1525-8955</identifier><identifier>DOI: 10.1109/TUFFC.2003.1209561</identifier><identifier>PMID: 12839185</identifier><identifier>CODEN: ITUCER</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Contact ; Crosstalk ; Exact sciences and technology ; Ferroelectric materials ; Frequency ; Infrared ; Infrared detectors ; Infrared, submillimeter wave, microwave and radiowave instruments, equipment and techniques ; Instruments, apparatus, components and techniques common to several branches of physics and astronomy ; Low frequencies ; Numerical models ; Optical modulation ; Physics ; Polymers ; Pyroelectricity ; Sensor arrays ; Silicon ; Silicon substrates ; Thermal imaging</subject><ispartof>IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2003-06, Vol.50 (6), p.720-723</ispartof><rights>2003 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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The sensitive element consists of a covering metal layer, infrared polymer absorber, front metal contact, sensitive pyroelectric element, the interconnecting column, and the bulk silicon readout. The results of numerical modeling show that the thermal crosstalk between sensitive elements to be critical especially at low frequency (f<10 Hz) of periodically modulated light.</description><subject>Contact</subject><subject>Crosstalk</subject><subject>Exact sciences and technology</subject><subject>Ferroelectric materials</subject><subject>Frequency</subject><subject>Infrared</subject><subject>Infrared detectors</subject><subject>Infrared, submillimeter wave, microwave and radiowave instruments, equipment and techniques</subject><subject>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</subject><subject>Low frequencies</subject><subject>Numerical models</subject><subject>Optical modulation</subject><subject>Physics</subject><subject>Polymers</subject><subject>Pyroelectricity</subject><subject>Sensor arrays</subject><subject>Silicon</subject><subject>Silicon substrates</subject><subject>Thermal imaging</subject><issn>0885-3010</issn><issn>1525-8955</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2003</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqFkU1rFEEQhhtRzJr4BxSkEZRcZq3-3O5jWFwNBDxkc256eqvXifOxds8I-ff2ZgciHvRUUDz1FlUPIW8YLBkD-2l7t9mslxxALBkHqzR7RhZMcVUZq9RzsgBjVCWAwRl5lfM9AJPS8pfkjHEjLDNqQW633zF1vqUhDTmPvv1Bm556uk_DdKBDpIeHNGCLYUxNoBn73IzNL6Sl1WE_ZhqHRMc5o-n8vun3F-RF9G3G13M9J3ebz9v11-rm25fr9dVNFaSEsfLGAos1SO6FD5EFkLXSaGPcccljCMZLjApNLYJf1VFoDQigbIg26nonzsnHU-4hDT8nzKPrmhywbX2Pw5TdSkiurYT_gtxoKZWyBbz8J8j0ignDJGMFff8Xej9MqS_3OmMkV0KALhA_QY_fTRjdIZUnpQfHwB0dukeH7ujQzQ7L0Ls5eao73D2NzNIK8GEGfA6-jcn3oclPnDSrsvx49tsT1yDiHzGnNb8BxI2tUw</recordid><startdate>20030601</startdate><enddate>20030601</enddate><creator>Yung Sup Yoon</creator><creator>Samoilov, V.B.</creator><creator>Kletsky, S.V.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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The sensitive element consists of a covering metal layer, infrared polymer absorber, front metal contact, sensitive pyroelectric element, the interconnecting column, and the bulk silicon readout. The results of numerical modeling show that the thermal crosstalk between sensitive elements to be critical especially at low frequency (f<10 Hz) of periodically modulated light.</abstract><cop>New York, NY</cop><pub>IEEE</pub><pmid>12839185</pmid><doi>10.1109/TUFFC.2003.1209561</doi><tpages>4</tpages></addata></record> |
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| identifier | ISSN: 0885-3010 |
| ispartof | IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2003-06, Vol.50 (6), p.720-723 |
| issn | 0885-3010 1525-8955 |
| language | eng |
| recordid | cdi_ieee_primary_1209561 |
| source | IEEE Electronic Library (IEL) |
| subjects | Contact Crosstalk Exact sciences and technology Ferroelectric materials Frequency Infrared Infrared detectors Infrared, submillimeter wave, microwave and radiowave instruments, equipment and techniques Instruments, apparatus, components and techniques common to several branches of physics and astronomy Low frequencies Numerical models Optical modulation Physics Polymers Pyroelectricity Sensor arrays Silicon Silicon substrates Thermal imaging |
| title | Thermal crosstalk in a group of pyroelectric sensitive elements for thermal imaging |
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