Productivity enhancement using a methodical approach to defect reduction based on synergy of process and defect metrology knowledge

Increased process equipment complexity and cost related to tool down time stimulate a stronger partnership between chip manufacturer and process equipment vendor to minimize the risk to production. Applied Materials is engaged in various process equipment-related service programs at customer manufac...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Schreutelkamp, R., van der Reijden, M., King, T., Mast, K., Englard, I., Zondag, J., Rommel, F., Harzenetter, S., Schoel, H., Cavelaars, J., Swaanen, M., Liang Shi, Sahr, H., Gerwig, M., Junker, M., Poschadel, R., Hein, B.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 16
container_issue
container_start_page 9
container_title
container_volume
creator Schreutelkamp, R.
van der Reijden, M.
King, T.
Mast, K.
Englard, I.
Zondag, J.
Rommel, F.
Harzenetter, S.
Schoel, H.
Cavelaars, J.
Swaanen, M.
Liang Shi
Sahr, H.
Gerwig, M.
Junker, M.
Poschadel, R.
Hein, B.
description Increased process equipment complexity and cost related to tool down time stimulate a stronger partnership between chip manufacturer and process equipment vendor to minimize the risk to production. Applied Materials is engaged in various process equipment-related service programs at customer manufacturing sites ranging from complementation of the manufacturer's own factory service organization to full ownership of equipment. In this paper, we discuss one aspect of service offerings that targets at defect reduction and productivity enhancement. Successful implementation at Philips Semiconductors of a methodology to perform defect reduction and productivity enhancement programs is discussed. Examples of using the described methodology are provided in this paper for programs targeted at DO baseline defect density reduction, mean wafer between clean (MWBC) improvement, and limitation of yield loss related to intermittent particle bursts.
doi_str_mv 10.1109/ASMC.2003.1194460
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1194460</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1194460</ieee_id><sourcerecordid>1194460</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-31f28ad718aecce56e71f2118069b78a25b19bf17fd717bfedef74157bd83b323</originalsourceid><addsrcrecordid>eNo1UMtOwzAQtHhIhNIPQFz8AyneOImdY1XxkopAAs6VY29aQ2pXsQvKmR_HgrKX3ZmdmZWWkEtgMwDWXM9fHhezgjGeYFOWNTsiWcFFndd1I47JOROSJSgBTkgGCeVSlPyMTEN4Z6nKCmpRZeT7efBmr6P9tHGk6DbKadyii3QfrFtTRbcYN95YrXqqdrvBK72h0VODHepIB_x1e0dbFdDQNITR4bAeqe9okmsMgSpn_g0pbvC9T_sP5796NGu8IKed6gNOD31C3m5vXhf3-fLp7mExX-YWRBVzDl0hlREgFWqNVY0iMQCS1U0rpCqqFpq2A9EljWg7TBdFCZVojeQtL_iEXP3lWkRc7Qa7VcO4OvyP_wBvB2Wz</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Productivity enhancement using a methodical approach to defect reduction based on synergy of process and defect metrology knowledge</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Schreutelkamp, R. ; van der Reijden, M. ; King, T. ; Mast, K. ; Englard, I. ; Zondag, J. ; Rommel, F. ; Harzenetter, S. ; Schoel, H. ; Cavelaars, J. ; Swaanen, M. ; Liang Shi ; Sahr, H. ; Gerwig, M. ; Junker, M. ; Poschadel, R. ; Hein, B.</creator><creatorcontrib>Schreutelkamp, R. ; van der Reijden, M. ; King, T. ; Mast, K. ; Englard, I. ; Zondag, J. ; Rommel, F. ; Harzenetter, S. ; Schoel, H. ; Cavelaars, J. ; Swaanen, M. ; Liang Shi ; Sahr, H. ; Gerwig, M. ; Junker, M. ; Poschadel, R. ; Hein, B.</creatorcontrib><description>Increased process equipment complexity and cost related to tool down time stimulate a stronger partnership between chip manufacturer and process equipment vendor to minimize the risk to production. Applied Materials is engaged in various process equipment-related service programs at customer manufacturing sites ranging from complementation of the manufacturer's own factory service organization to full ownership of equipment. In this paper, we discuss one aspect of service offerings that targets at defect reduction and productivity enhancement. Successful implementation at Philips Semiconductors of a methodology to perform defect reduction and productivity enhancement programs is discussed. Examples of using the described methodology are provided in this paper for programs targeted at DO baseline defect density reduction, mean wafer between clean (MWBC) improvement, and limitation of yield loss related to intermittent particle bursts.</description><identifier>ISSN: 1078-8743</identifier><identifier>ISBN: 0780376811</identifier><identifier>ISBN: 0780376730</identifier><identifier>ISBN: 9780780376731</identifier><identifier>ISBN: 9780780376816</identifier><identifier>EISSN: 2376-6697</identifier><identifier>DOI: 10.1109/ASMC.2003.1194460</identifier><language>eng</language><publisher>IEEE</publisher><subject>Data mining ; Etching ; Libraries ; Manufacturing processes ; Metrology ; Monitoring ; Particle production ; Productivity ; Semiconductor device manufacture ; Semiconductor materials</subject><ispartof>Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI, 2003, p.9-16</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1194460$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1194460$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Schreutelkamp, R.</creatorcontrib><creatorcontrib>van der Reijden, M.</creatorcontrib><creatorcontrib>King, T.</creatorcontrib><creatorcontrib>Mast, K.</creatorcontrib><creatorcontrib>Englard, I.</creatorcontrib><creatorcontrib>Zondag, J.</creatorcontrib><creatorcontrib>Rommel, F.</creatorcontrib><creatorcontrib>Harzenetter, S.</creatorcontrib><creatorcontrib>Schoel, H.</creatorcontrib><creatorcontrib>Cavelaars, J.</creatorcontrib><creatorcontrib>Swaanen, M.</creatorcontrib><creatorcontrib>Liang Shi</creatorcontrib><creatorcontrib>Sahr, H.</creatorcontrib><creatorcontrib>Gerwig, M.</creatorcontrib><creatorcontrib>Junker, M.</creatorcontrib><creatorcontrib>Poschadel, R.</creatorcontrib><creatorcontrib>Hein, B.</creatorcontrib><title>Productivity enhancement using a methodical approach to defect reduction based on synergy of process and defect metrology knowledge</title><title>Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI</title><addtitle>ASMC</addtitle><description>Increased process equipment complexity and cost related to tool down time stimulate a stronger partnership between chip manufacturer and process equipment vendor to minimize the risk to production. Applied Materials is engaged in various process equipment-related service programs at customer manufacturing sites ranging from complementation of the manufacturer's own factory service organization to full ownership of equipment. In this paper, we discuss one aspect of service offerings that targets at defect reduction and productivity enhancement. Successful implementation at Philips Semiconductors of a methodology to perform defect reduction and productivity enhancement programs is discussed. Examples of using the described methodology are provided in this paper for programs targeted at DO baseline defect density reduction, mean wafer between clean (MWBC) improvement, and limitation of yield loss related to intermittent particle bursts.</description><subject>Data mining</subject><subject>Etching</subject><subject>Libraries</subject><subject>Manufacturing processes</subject><subject>Metrology</subject><subject>Monitoring</subject><subject>Particle production</subject><subject>Productivity</subject><subject>Semiconductor device manufacture</subject><subject>Semiconductor materials</subject><issn>1078-8743</issn><issn>2376-6697</issn><isbn>0780376811</isbn><isbn>0780376730</isbn><isbn>9780780376731</isbn><isbn>9780780376816</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2003</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1UMtOwzAQtHhIhNIPQFz8AyneOImdY1XxkopAAs6VY29aQ2pXsQvKmR_HgrKX3ZmdmZWWkEtgMwDWXM9fHhezgjGeYFOWNTsiWcFFndd1I47JOROSJSgBTkgGCeVSlPyMTEN4Z6nKCmpRZeT7efBmr6P9tHGk6DbKadyii3QfrFtTRbcYN95YrXqqdrvBK72h0VODHepIB_x1e0dbFdDQNITR4bAeqe9okmsMgSpn_g0pbvC9T_sP5796NGu8IKed6gNOD31C3m5vXhf3-fLp7mExX-YWRBVzDl0hlREgFWqNVY0iMQCS1U0rpCqqFpq2A9EljWg7TBdFCZVojeQtL_iEXP3lWkRc7Qa7VcO4OvyP_wBvB2Wz</recordid><startdate>2003</startdate><enddate>2003</enddate><creator>Schreutelkamp, R.</creator><creator>van der Reijden, M.</creator><creator>King, T.</creator><creator>Mast, K.</creator><creator>Englard, I.</creator><creator>Zondag, J.</creator><creator>Rommel, F.</creator><creator>Harzenetter, S.</creator><creator>Schoel, H.</creator><creator>Cavelaars, J.</creator><creator>Swaanen, M.</creator><creator>Liang Shi</creator><creator>Sahr, H.</creator><creator>Gerwig, M.</creator><creator>Junker, M.</creator><creator>Poschadel, R.</creator><creator>Hein, B.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2003</creationdate><title>Productivity enhancement using a methodical approach to defect reduction based on synergy of process and defect metrology knowledge</title><author>Schreutelkamp, R. ; van der Reijden, M. ; King, T. ; Mast, K. ; Englard, I. ; Zondag, J. ; Rommel, F. ; Harzenetter, S. ; Schoel, H. ; Cavelaars, J. ; Swaanen, M. ; Liang Shi ; Sahr, H. ; Gerwig, M. ; Junker, M. ; Poschadel, R. ; Hein, B.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-31f28ad718aecce56e71f2118069b78a25b19bf17fd717bfedef74157bd83b323</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Data mining</topic><topic>Etching</topic><topic>Libraries</topic><topic>Manufacturing processes</topic><topic>Metrology</topic><topic>Monitoring</topic><topic>Particle production</topic><topic>Productivity</topic><topic>Semiconductor device manufacture</topic><topic>Semiconductor materials</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Schreutelkamp, R.</creatorcontrib><creatorcontrib>van der Reijden, M.</creatorcontrib><creatorcontrib>King, T.</creatorcontrib><creatorcontrib>Mast, K.</creatorcontrib><creatorcontrib>Englard, I.</creatorcontrib><creatorcontrib>Zondag, J.</creatorcontrib><creatorcontrib>Rommel, F.</creatorcontrib><creatorcontrib>Harzenetter, S.</creatorcontrib><creatorcontrib>Schoel, H.</creatorcontrib><creatorcontrib>Cavelaars, J.</creatorcontrib><creatorcontrib>Swaanen, M.</creatorcontrib><creatorcontrib>Liang Shi</creatorcontrib><creatorcontrib>Sahr, H.</creatorcontrib><creatorcontrib>Gerwig, M.</creatorcontrib><creatorcontrib>Junker, M.</creatorcontrib><creatorcontrib>Poschadel, R.</creatorcontrib><creatorcontrib>Hein, B.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Schreutelkamp, R.</au><au>van der Reijden, M.</au><au>King, T.</au><au>Mast, K.</au><au>Englard, I.</au><au>Zondag, J.</au><au>Rommel, F.</au><au>Harzenetter, S.</au><au>Schoel, H.</au><au>Cavelaars, J.</au><au>Swaanen, M.</au><au>Liang Shi</au><au>Sahr, H.</au><au>Gerwig, M.</au><au>Junker, M.</au><au>Poschadel, R.</au><au>Hein, B.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Productivity enhancement using a methodical approach to defect reduction based on synergy of process and defect metrology knowledge</atitle><btitle>Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI</btitle><stitle>ASMC</stitle><date>2003</date><risdate>2003</risdate><spage>9</spage><epage>16</epage><pages>9-16</pages><issn>1078-8743</issn><eissn>2376-6697</eissn><isbn>0780376811</isbn><isbn>0780376730</isbn><isbn>9780780376731</isbn><isbn>9780780376816</isbn><abstract>Increased process equipment complexity and cost related to tool down time stimulate a stronger partnership between chip manufacturer and process equipment vendor to minimize the risk to production. Applied Materials is engaged in various process equipment-related service programs at customer manufacturing sites ranging from complementation of the manufacturer's own factory service organization to full ownership of equipment. In this paper, we discuss one aspect of service offerings that targets at defect reduction and productivity enhancement. Successful implementation at Philips Semiconductors of a methodology to perform defect reduction and productivity enhancement programs is discussed. Examples of using the described methodology are provided in this paper for programs targeted at DO baseline defect density reduction, mean wafer between clean (MWBC) improvement, and limitation of yield loss related to intermittent particle bursts.</abstract><pub>IEEE</pub><doi>10.1109/ASMC.2003.1194460</doi><tpages>8</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 1078-8743
ispartof Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI, 2003, p.9-16
issn 1078-8743
2376-6697
language eng
recordid cdi_ieee_primary_1194460
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Data mining
Etching
Libraries
Manufacturing processes
Metrology
Monitoring
Particle production
Productivity
Semiconductor device manufacture
Semiconductor materials
title Productivity enhancement using a methodical approach to defect reduction based on synergy of process and defect metrology knowledge
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-21T12%3A25%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Productivity%20enhancement%20using%20a%20methodical%20approach%20to%20defect%20reduction%20based%20on%20synergy%20of%20process%20and%20defect%20metrology%20knowledge&rft.btitle=Advanced%20Semiconductor%20Manufacturing%20Conference%20and%20Workshop,%202003%20IEEEI/SEMI&rft.au=Schreutelkamp,%20R.&rft.date=2003&rft.spage=9&rft.epage=16&rft.pages=9-16&rft.issn=1078-8743&rft.eissn=2376-6697&rft.isbn=0780376811&rft.isbn_list=0780376730&rft.isbn_list=9780780376731&rft.isbn_list=9780780376816&rft_id=info:doi/10.1109/ASMC.2003.1194460&rft_dat=%3Cieee_6IE%3E1194460%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1194460&rfr_iscdi=true