Analysis the influence of electroplate on the chip-type LTCC filter's input/output ports

Analysis the influence of electroplate on the chip-type LTCC filter's input/output ports

A ultra-small LTCC filter, which designed in the frequency of 5GHz for wireless-LAN application has developed. It has the size of 2.0mm /spl times/1.25mm /spl times/ 0.85mm. We have compared several kind's electroplate types. It could interfere the electrical characteristic significantly. The b...

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Hauptverfasser: Ching-Wen Tang, Wen-Hsi Lee, Hsin-Yin Yao, Wen-Long Leu, Chi-Yang Chang
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Attenuation
Band pass filters
Electric variables
Electrodes
Electronics packaging
Insertion loss
Printed circuits
Radio frequency
Semiconductor device measurement
Surface-mount technology
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creator Ching-Wen Tang
Wen-Hsi Lee
Hsin-Yin Yao
Wen-Long Leu
Chi-Yang Chang
description A ultra-small LTCC filter, which designed in the frequency of 5GHz for wireless-LAN application has developed. It has the size of 2.0mm /spl times/1.25mm /spl times/ 0.85mm. We have compared several kind's electroplate types. It could interfere the electrical characteristic significantly. The best way used in the chip-type filter process can be chosen according detail analysis these results.
doi_str_mv 10.1109/EMAP.2002.1188872
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1188872</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1188872</ieee_id><sourcerecordid>1188872</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-7e0cf3ffcf566ffb9baf6bcd8ceed5d8f4b1d72f45fedfc00d23e702a18490873</originalsourceid><addsrcrecordid>eNotjz1rwzAYhAWl0DbNDyhdtHVyIskfkkdj0g9waYcUsgVZel-iotrCkof8-5o2tzwc3B0cIQ-cbThn9Xb33nxuBGNisUopKa7IHZOK5bJS4nBD1jF-s0VFUQpZ35JDM2h_ji7SdALqBvQzDAboiBQ8mDSNweu0-OEvYE4uZOkcgHb7tqXofILpKS7FMKftOKcFNIxTivfkGrWPsL5wRb6ed_v2Nes-Xt7apsscl2XKJDCDOaLBsqoQ-7rXWPXGKgNgS6uw6LmVAosSwaJhzIocJBOaq6JmSuYr8vi_6wDgGCb3o6fz8XI-_wXfWVJG</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Analysis the influence of electroplate on the chip-type LTCC filter's input/output ports</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Ching-Wen Tang ; Wen-Hsi Lee ; Hsin-Yin Yao ; Wen-Long Leu ; Chi-Yang Chang</creator><creatorcontrib>Ching-Wen Tang ; Wen-Hsi Lee ; Hsin-Yin Yao ; Wen-Long Leu ; Chi-Yang Chang</creatorcontrib><description>A ultra-small LTCC filter, which designed in the frequency of 5GHz for wireless-LAN application has developed. It has the size of 2.0mm /spl times/1.25mm /spl times/ 0.85mm. We have compared several kind's electroplate types. It could interfere the electrical characteristic significantly. The best way used in the chip-type filter process can be chosen according detail analysis these results.</description><identifier>ISBN: 078037682X</identifier><identifier>ISBN: 9780780376823</identifier><identifier>DOI: 10.1109/EMAP.2002.1188872</identifier><language>eng</language><publisher>IEEE</publisher><subject>Attenuation ; Band pass filters ; Electric variables ; Electrodes ; Electronics packaging ; Insertion loss ; Printed circuits ; Radio frequency ; Semiconductor device measurement ; Surface-mount technology</subject><ispartof>Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002, 2002, p.397-402</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1188872$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,4036,4037,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1188872$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Ching-Wen Tang</creatorcontrib><creatorcontrib>Wen-Hsi Lee</creatorcontrib><creatorcontrib>Hsin-Yin Yao</creatorcontrib><creatorcontrib>Wen-Long Leu</creatorcontrib><creatorcontrib>Chi-Yang Chang</creatorcontrib><title>Analysis the influence of electroplate on the chip-type LTCC filter's input/output ports</title><title>Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002</title><addtitle>EMAP</addtitle><description>A ultra-small LTCC filter, which designed in the frequency of 5GHz for wireless-LAN application has developed. It has the size of 2.0mm /spl times/1.25mm /spl times/ 0.85mm. We have compared several kind's electroplate types. It could interfere the electrical characteristic significantly. The best way used in the chip-type filter process can be chosen according detail analysis these results.</description><subject>Attenuation</subject><subject>Band pass filters</subject><subject>Electric variables</subject><subject>Electrodes</subject><subject>Electronics packaging</subject><subject>Insertion loss</subject><subject>Printed circuits</subject><subject>Radio frequency</subject><subject>Semiconductor device measurement</subject><subject>Surface-mount technology</subject><isbn>078037682X</isbn><isbn>9780780376823</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2002</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotjz1rwzAYhAWl0DbNDyhdtHVyIskfkkdj0g9waYcUsgVZel-iotrCkof8-5o2tzwc3B0cIQ-cbThn9Xb33nxuBGNisUopKa7IHZOK5bJS4nBD1jF-s0VFUQpZ35JDM2h_ji7SdALqBvQzDAboiBQ8mDSNweu0-OEvYE4uZOkcgHb7tqXofILpKS7FMKftOKcFNIxTivfkGrWPsL5wRb6ed_v2Nes-Xt7apsscl2XKJDCDOaLBsqoQ-7rXWPXGKgNgS6uw6LmVAosSwaJhzIocJBOaq6JmSuYr8vi_6wDgGCb3o6fz8XI-_wXfWVJG</recordid><startdate>2002</startdate><enddate>2002</enddate><creator>Ching-Wen Tang</creator><creator>Wen-Hsi Lee</creator><creator>Hsin-Yin Yao</creator><creator>Wen-Long Leu</creator><creator>Chi-Yang Chang</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2002</creationdate><title>Analysis the influence of electroplate on the chip-type LTCC filter's input/output ports</title><author>Ching-Wen Tang ; Wen-Hsi Lee ; Hsin-Yin Yao ; Wen-Long Leu ; Chi-Yang Chang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-7e0cf3ffcf566ffb9baf6bcd8ceed5d8f4b1d72f45fedfc00d23e702a18490873</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Attenuation</topic><topic>Band pass filters</topic><topic>Electric variables</topic><topic>Electrodes</topic><topic>Electronics packaging</topic><topic>Insertion loss</topic><topic>Printed circuits</topic><topic>Radio frequency</topic><topic>Semiconductor device measurement</topic><topic>Surface-mount technology</topic><toplevel>online_resources</toplevel><creatorcontrib>Ching-Wen Tang</creatorcontrib><creatorcontrib>Wen-Hsi Lee</creatorcontrib><creatorcontrib>Hsin-Yin Yao</creatorcontrib><creatorcontrib>Wen-Long Leu</creatorcontrib><creatorcontrib>Chi-Yang Chang</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ching-Wen Tang</au><au>Wen-Hsi Lee</au><au>Hsin-Yin Yao</au><au>Wen-Long Leu</au><au>Chi-Yang Chang</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Analysis the influence of electroplate on the chip-type LTCC filter's input/output ports</atitle><btitle>Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002</btitle><stitle>EMAP</stitle><date>2002</date><risdate>2002</risdate><spage>397</spage><epage>402</epage><pages>397-402</pages><isbn>078037682X</isbn><isbn>9780780376823</isbn><abstract>A ultra-small LTCC filter, which designed in the frequency of 5GHz for wireless-LAN application has developed. It has the size of 2.0mm /spl times/1.25mm /spl times/ 0.85mm. We have compared several kind's electroplate types. It could interfere the electrical characteristic significantly. The best way used in the chip-type filter process can be chosen according detail analysis these results.</abstract><pub>IEEE</pub><doi>10.1109/EMAP.2002.1188872</doi><tpages>6</tpages></addata></record>
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subjects Attenuation
Band pass filters
Electric variables
Electrodes
Electronics packaging
Insertion loss
Printed circuits
Radio frequency
Semiconductor device measurement
Surface-mount technology
title Analysis the influence of electroplate on the chip-type LTCC filter's input/output ports
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T19%3A43%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Analysis%20the%20influence%20of%20electroplate%20on%20the%20chip-type%20LTCC%20filter's%20input/output%20ports&rft.btitle=Proceedings%20of%20the%204th%20International%20Symposium%20on%20Electronic%20Materials%20and%20Packaging,%202002&rft.au=Ching-Wen%20Tang&rft.date=2002&rft.spage=397&rft.epage=402&rft.pages=397-402&rft.isbn=078037682X&rft.isbn_list=9780780376823&rft_id=info:doi/10.1109/EMAP.2002.1188872&rft_dat=%3Cieee_6IE%3E1188872%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1188872&rfr_iscdi=true