Effect of phosphorus content and solid state aging on intermetallic formation between lead-free Sn-Ag-Cu solder and electroless nickel/immersion gold under bump metallurgy

We have examined the effect of phosphorus content in the electroless nickel/immersion gold (ENIG) under bump metallurgy and the effect of solid-state aging at 150/spl deg/C on the formation and resultant morphology of the intermetallics formed between Sn-Ag-Cu (lead-free) solder and electroless Ni-P...

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Bibliographische Detailangaben

Hauptverfasser:	Tai, S.F., Ourdjini, A., Khong, Y.L., Venkatesh, V.C., Tamin, M.N.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aging Copper Environmentally friendly manufacturing techniques Gold Intermetallic Lead Morphology Nickel Solid state circuits Tin
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