Role of adhesive modulus on reliability of FCBGA with heat spreader

Finite element models of a flip chip ball grid array (FCBGA) package are utilized to determine the initiation of CTE mismatch induced defects, starting in the solder mask layer of the substrate and penetrating the copper traces to cause reliability failures of flip chip packages, with different adhe...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Hsien-Fu Hsiao
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Composite materials Copper Electronics packaging Finite element methods Flip chip Mechanical factors Parametric study Temperature dependence Thermal stresses Thermomechanical processes
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!