Finite Element Analysis and Multi-Objective Optimization of Solder Joint Temperature Difference and Cooling Stress During PCBA Reflow Process

A finite element analysis model of a printed circuit board assembly (PCBA) was established. The model was subjected to a reflow soldering temperature profile to analyze the temperature distribution at the solder joint solidification moment and the cooling stress distribution at the end of the reflow...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2025-01, p.1-1
Hauptverfasser:	Lan, Jingyi, Huang, Chunyue, Liang, Ying, Gao, Chao, Wang, Gui, Cao, Zhiqin
Format:	Artikel
Sprache:	eng
Schlagworte:	Cooling Finite element analysis Integrated circuit modeling Lead multi-objective optimization Packaging PCBA solder joints Reflow soldering Semiconductor device modeling Stress temperature difference and cooling stress Temperature distribution Thermal conductivity
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