RPP-model trends across technology nodes for the MC simulation of SEUs in commercial bulk planar CMOS SRAMs under proton irradiation
The ubiquitous use of electronic devices in high-radiation environments requires robust methods for assessing and improving their resilience against single-event effects and, especially, single-event upsets (SEUs). In this study, SEU production induced by protons below 500 MeV in three commercial bu...
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description | The ubiquitous use of electronic devices in high-radiation environments requires robust methods for assessing and improving their resilience against single-event effects and, especially, single-event upsets (SEUs). In this study, SEU production induced by protons below 500 MeV in three commercial bulk planar static random access memories (SRAMs) manufactured on different standard CMOS technology nodes (from 250 nm to 40 nm) is investigated employing the Monte Carlo particle-transport code FLUKA. A rectangular parallelepiped (RPP) model is adopted to describe the device geometry, relying on the sensitive volume and the critical charge as effective parameters. Optimal values of these two parameters which maximize the agreement between simulated and experimental SEU production cross sections are found for the three considered devices. Parameter trends in the RPP-model across technology nodes are identified, thus providing practical guidelines when modelling components manufactured on other technology nodes. |
doi_str_mv | 10.1109/TNS.2024.3520506 |
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In this study, SEU production induced by protons below 500 MeV in three commercial bulk planar static random access memories (SRAMs) manufactured on different standard CMOS technology nodes (from 250 nm to 40 nm) is investigated employing the Monte Carlo particle-transport code FLUKA. A rectangular parallelepiped (RPP) model is adopted to describe the device geometry, relying on the sensitive volume and the critical charge as effective parameters. Optimal values of these two parameters which maximize the agreement between simulated and experimental SEU production cross sections are found for the three considered devices. Parameter trends in the RPP-model across technology nodes are identified, thus providing practical guidelines when modelling components manufactured on other technology nodes.</description><subject>critical charge</subject><subject>FLUKA</subject><subject>Integrated circuit modeling</subject><subject>Ions</subject><subject>Monitoring</subject><subject>Monte Carlo simulation</subject><subject>Production</subject><subject>Protons</subject><subject>Random access memory</subject><subject>RPP model</subject><subject>Semiconductor device modeling</subject><subject>sensitive volume</subject><subject>Single event upsets</subject><subject>Single-event effects (SEEs)</subject><subject>single-event upsets (SEUs)</subject><subject>Solid modeling</subject><subject>technology node</subject><subject>technology trend</subject><issn>0018-9499</issn><issn>1558-1578</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><sourceid>ESBDL</sourceid><sourceid>RIE</sourceid><recordid>eNpNkD1vwjAQhq2qlUpp9w4d7g-E2rGdOCOK6IcEBRGYI8exi9skRnYY2PvDGwpDp9Pp7nl19yD0SPCEEJw9bz6KSYxjNqE8xhwnV2hEOBcR4am4RiOMiYgylmW36C6Er6FlHPMR-lmvVlHrat1A73VXB5DKuxCg12rXucZ9HqEbxgGM89DvNCxyCLY9NLK3rgNnoJhtA9gOlGtb7ZWVDVSH5hv2jeykh3yxLKBYTxcBDl2tPey96wfSei9r-5dyj26MbIJ-uNQx2r7MNvlbNF--vufTeaQIZknEKxMLymKc0DRhJlYipUQRYWgiMK1UIgQlFaGcxLFkssYmU0ZTk9aC1ZxoOkb4nPv3otem3HvbSn8sCS5PFsvBYnmyWF4sDsjTGbFa63_rYriIcfoLt_xukg</recordid><startdate>20241219</startdate><enddate>20241219</enddate><creator>Serban, Alexandra-Gabriela</creator><creator>Coronetti, Andrea</creator><creator>Alia, Ruben Garcia</creator><creator>Salvat-Pujol, Francesc</creator><general>IEEE</general><scope>97E</scope><scope>ESBDL</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><orcidid>https://orcid.org/0000-0001-8840-7400</orcidid><orcidid>https://orcid.org/0009-0002-0008-7524</orcidid></search><sort><creationdate>20241219</creationdate><title>RPP-model trends across technology nodes for the MC simulation of SEUs in commercial bulk planar CMOS SRAMs under proton irradiation</title><author>Serban, Alexandra-Gabriela ; Coronetti, Andrea ; Alia, Ruben Garcia ; Salvat-Pujol, Francesc</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c1046-5bf28342063764f2c8731c18f36803bc68831b135122a4ad0f9cfe3f7d84d51e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>critical charge</topic><topic>FLUKA</topic><topic>Integrated circuit modeling</topic><topic>Ions</topic><topic>Monitoring</topic><topic>Monte Carlo simulation</topic><topic>Production</topic><topic>Protons</topic><topic>Random access memory</topic><topic>RPP model</topic><topic>Semiconductor device modeling</topic><topic>sensitive volume</topic><topic>Single event upsets</topic><topic>Single-event effects (SEEs)</topic><topic>single-event upsets (SEUs)</topic><topic>Solid modeling</topic><topic>technology node</topic><topic>technology trend</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Serban, Alexandra-Gabriela</creatorcontrib><creatorcontrib>Coronetti, Andrea</creatorcontrib><creatorcontrib>Alia, Ruben Garcia</creatorcontrib><creatorcontrib>Salvat-Pujol, Francesc</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE Open Access Journals</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998–Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><jtitle>IEEE transactions on nuclear science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Serban, Alexandra-Gabriela</au><au>Coronetti, Andrea</au><au>Alia, Ruben Garcia</au><au>Salvat-Pujol, Francesc</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>RPP-model trends across technology nodes for the MC simulation of SEUs in commercial bulk planar CMOS SRAMs under proton irradiation</atitle><jtitle>IEEE transactions on nuclear science</jtitle><stitle>TNS</stitle><date>2024-12-19</date><risdate>2024</risdate><spage>1</spage><epage>1</epage><pages>1-1</pages><issn>0018-9499</issn><eissn>1558-1578</eissn><coden>IETNAE</coden><abstract>The ubiquitous use of electronic devices in high-radiation environments requires robust methods for assessing and improving their resilience against single-event effects and, especially, single-event upsets (SEUs). In this study, SEU production induced by protons below 500 MeV in three commercial bulk planar static random access memories (SRAMs) manufactured on different standard CMOS technology nodes (from 250 nm to 40 nm) is investigated employing the Monte Carlo particle-transport code FLUKA. A rectangular parallelepiped (RPP) model is adopted to describe the device geometry, relying on the sensitive volume and the critical charge as effective parameters. Optimal values of these two parameters which maximize the agreement between simulated and experimental SEU production cross sections are found for the three considered devices. 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subjects | critical charge FLUKA Integrated circuit modeling Ions Monitoring Monte Carlo simulation Production Protons Random access memory RPP model Semiconductor device modeling sensitive volume Single event upsets Single-event effects (SEEs) single-event upsets (SEUs) Solid modeling technology node technology trend |
title | RPP-model trends across technology nodes for the MC simulation of SEUs in commercial bulk planar CMOS SRAMs under proton irradiation |
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