A Novel Condition Monitoring Method for Full Modes of Package Degradation in High Power Modules Based on Hysteresis Curves of Forward Voltage Drop

Package degradation for high power IGBT Modules would seriously affect the operation safety of power electronic converters. Due to the variety of degradation modes, state-ofthe-art monitoring methods still struggle to comprehensively evaluate the health status of the module. Therefore, this paper ai...

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Veröffentlicht in:	IEEE transactions on power electronics 2024-11, p.1-13
Hauptverfasser:	Wang, Yuchen, Zhang, Hong, Wang, Jianpeng, Zhang, Jin, Wang, Tianjian, Liu, Yi, Wang, Laili, Pei, Yunqing, She, Xiaoliang, Liu, Jinjun
Format:	Artikel
Sprache:	eng
Schlagworte:	Aging Condition monitoring Degradation Fatigue Heating systems Hysteresis Insulated gate bipolar transistors Inverters Junctions Monitoring Semiconductor device reliability Temperature Wires
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