A Compact Magnetoresistance-Rogowski Hybrid Sensor for Multichip Online Current Sensing in Press-Pack Power Module

Press-pack power module has recently become a crucial component for large-current and high-power facilities. Several semiconductor chips are connected in parallel inside the module. Due to the complex coupling of electrical, thermal, and mechanical fields within the device, the imbalance in pressure...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE transactions on industrial electronics (1982) 2024-09, Vol.71 (9), p.11529-11539
Hauptverfasser: Guo, Weili, Xiao, Guochun, Wang, Laili
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!