Using of solderable conductive pastes in PCB prototyping

The paper presents some tests in the field of through-hole plating process using special solderable conductive pastes in order to metallize the barrel of drilled holes for vias. The process consists of dispensing the special paste into holes, absorption of paste from them, keeping inside only the ne...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Marin, A., Svasta, P., Ionescu, C., Codreanu, N.-D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Absorption Curing Electronic equipment testing Equations Integrated circuit interconnections Marine technology Metallization Ovens Paper technology Prototypes
Online-Zugang:	Volltext bestellen
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