Using of solderable conductive pastes in PCB prototyping

Using of solderable conductive pastes in PCB prototyping

The paper presents some tests in the field of through-hole plating process using special solderable conductive pastes in order to metallize the barrel of drilled holes for vias. The process consists of dispensing the special paste into holes, absorption of paste from them, keeping inside only the ne...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Marin, A., Svasta, P., Ionescu, C., Codreanu, N.-D.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Absorption
Curing
Electronic equipment testing
Equations
Integrated circuit interconnections
Marine technology
Metallization
Ovens
Paper technology
Prototypes
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 21
container_issue
container_start_page 17
container_title
container_volume
creator Marin, A.
Svasta, P.
Ionescu, C.
Codreanu, N.-D.
description The paper presents some tests in the field of through-hole plating process using special solderable conductive pastes in order to metallize the barrel of drilled holes for vias. The process consists of dispensing the special paste into holes, absorption of paste from them, keeping inside only the necessary quantity for metallization, and curing the paste into a regular hot-air oven at 160/spl deg/C for 30 minutes. The process is appropriate for small/medium quantity of vias (less than 400) and FR4 substrate. The contact resistance, specified by producer as 150 m/spl Omega/, will be analyzed. In addition, pastes shall be evaluated as soldering materials destined for contacting the SMDs onto the printed circuit boards.
doi_str_mv 10.1109/POLYTR.2002.1020177
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_1020177</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1020177</ieee_id><sourcerecordid>1020177</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-9916c0d0c3285257160fc1bd69d303f3a643f36c9ee44a871326cfb2adef89c13</originalsourceid><addsrcrecordid>eNotj81KxDAUhQMiqOM8wWzyAq33Jm3SLLX4B4UZZAZ0NaTJjURqW5oqzNtbcM7ifKvzwWFsg5AjgrnbbZuP_VsuAESOIAC1vmA3oCuQulT6_YqtU_qCJUVRSgnXrDqk2H_yIfA0dJ4m23bE3dD7HzfHX-KjTTMlHnu-qx_4OA3zMJ_GZXLLLoPtEq3PXLHD0-O-fsma7fNrfd9kEXU5Z8agcuDBSVGVotSoIDhsvTJeggzSqmJp5QxRUdhKoxTKhVZYT6EyDuWKbf69kYiO4xS_7XQ6ns_JP-NbRTQ</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Using of solderable conductive pastes in PCB prototyping</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Marin, A. ; Svasta, P. ; Ionescu, C. ; Codreanu, N.-D.</creator><creatorcontrib>Marin, A. ; Svasta, P. ; Ionescu, C. ; Codreanu, N.-D.</creatorcontrib><description>The paper presents some tests in the field of through-hole plating process using special solderable conductive pastes in order to metallize the barrel of drilled holes for vias. The process consists of dispensing the special paste into holes, absorption of paste from them, keeping inside only the necessary quantity for metallization, and curing the paste into a regular hot-air oven at 160/spl deg/C for 30 minutes. The process is appropriate for small/medium quantity of vias (less than 400) and FR4 substrate. The contact resistance, specified by producer as 150 m/spl Omega/, will be analyzed. In addition, pastes shall be evaluated as soldering materials destined for contacting the SMDs onto the printed circuit boards.</description><identifier>ISBN: 078037567X</identifier><identifier>ISBN: 9780780375673</identifier><identifier>DOI: 10.1109/POLYTR.2002.1020177</identifier><language>eng</language><publisher>IEEE</publisher><subject>Absorption ; Curing ; Electronic equipment testing ; Equations ; Integrated circuit interconnections ; Marine technology ; Metallization ; Ovens ; Paper technology ; Prototypes</subject><ispartof>2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599), 2002, p.17-21</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1020177$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1020177$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Marin, A.</creatorcontrib><creatorcontrib>Svasta, P.</creatorcontrib><creatorcontrib>Ionescu, C.</creatorcontrib><creatorcontrib>Codreanu, N.-D.</creatorcontrib><title>Using of solderable conductive pastes in PCB prototyping</title><title>2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)</title><addtitle>POLYTR</addtitle><description>The paper presents some tests in the field of through-hole plating process using special solderable conductive pastes in order to metallize the barrel of drilled holes for vias. The process consists of dispensing the special paste into holes, absorption of paste from them, keeping inside only the necessary quantity for metallization, and curing the paste into a regular hot-air oven at 160/spl deg/C for 30 minutes. The process is appropriate for small/medium quantity of vias (less than 400) and FR4 substrate. The contact resistance, specified by producer as 150 m/spl Omega/, will be analyzed. In addition, pastes shall be evaluated as soldering materials destined for contacting the SMDs onto the printed circuit boards.</description><subject>Absorption</subject><subject>Curing</subject><subject>Electronic equipment testing</subject><subject>Equations</subject><subject>Integrated circuit interconnections</subject><subject>Marine technology</subject><subject>Metallization</subject><subject>Ovens</subject><subject>Paper technology</subject><subject>Prototypes</subject><isbn>078037567X</isbn><isbn>9780780375673</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2002</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj81KxDAUhQMiqOM8wWzyAq33Jm3SLLX4B4UZZAZ0NaTJjURqW5oqzNtbcM7ifKvzwWFsg5AjgrnbbZuP_VsuAESOIAC1vmA3oCuQulT6_YqtU_qCJUVRSgnXrDqk2H_yIfA0dJ4m23bE3dD7HzfHX-KjTTMlHnu-qx_4OA3zMJ_GZXLLLoPtEq3PXLHD0-O-fsma7fNrfd9kEXU5Z8agcuDBSVGVotSoIDhsvTJeggzSqmJp5QxRUdhKoxTKhVZYT6EyDuWKbf69kYiO4xS_7XQ6ns_JP-NbRTQ</recordid><startdate>2002</startdate><enddate>2002</enddate><creator>Marin, A.</creator><creator>Svasta, P.</creator><creator>Ionescu, C.</creator><creator>Codreanu, N.-D.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2002</creationdate><title>Using of solderable conductive pastes in PCB prototyping</title><author>Marin, A. ; Svasta, P. ; Ionescu, C. ; Codreanu, N.-D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-9916c0d0c3285257160fc1bd69d303f3a643f36c9ee44a871326cfb2adef89c13</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Absorption</topic><topic>Curing</topic><topic>Electronic equipment testing</topic><topic>Equations</topic><topic>Integrated circuit interconnections</topic><topic>Marine technology</topic><topic>Metallization</topic><topic>Ovens</topic><topic>Paper technology</topic><topic>Prototypes</topic><toplevel>online_resources</toplevel><creatorcontrib>Marin, A.</creatorcontrib><creatorcontrib>Svasta, P.</creatorcontrib><creatorcontrib>Ionescu, C.</creatorcontrib><creatorcontrib>Codreanu, N.-D.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Marin, A.</au><au>Svasta, P.</au><au>Ionescu, C.</au><au>Codreanu, N.-D.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Using of solderable conductive pastes in PCB prototyping</atitle><btitle>2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)</btitle><stitle>POLYTR</stitle><date>2002</date><risdate>2002</risdate><spage>17</spage><epage>21</epage><pages>17-21</pages><isbn>078037567X</isbn><isbn>9780780375673</isbn><abstract>The paper presents some tests in the field of through-hole plating process using special solderable conductive pastes in order to metallize the barrel of drilled holes for vias. The process consists of dispensing the special paste into holes, absorption of paste from them, keeping inside only the necessary quantity for metallization, and curing the paste into a regular hot-air oven at 160/spl deg/C for 30 minutes. The process is appropriate for small/medium quantity of vias (less than 400) and FR4 substrate. The contact resistance, specified by producer as 150 m/spl Omega/, will be analyzed. In addition, pastes shall be evaluated as soldering materials destined for contacting the SMDs onto the printed circuit boards.</abstract><pub>IEEE</pub><doi>10.1109/POLYTR.2002.1020177</doi><tpages>5</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISBN: 078037567X
ispartof 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599), 2002, p.17-21
issn
language eng
recordid cdi_ieee_primary_1020177
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Absorption
Curing
Electronic equipment testing
Equations
Integrated circuit interconnections
Marine technology
Metallization
Ovens
Paper technology
Prototypes
title Using of solderable conductive pastes in PCB prototyping
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-23T16%3A10%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Using%20of%20solderable%20conductive%20pastes%20in%20PCB%20prototyping&rft.btitle=2nd%20International%20IEEE%20Conference%20on%20Polymers%20and%20Adhesives%20in%20Microelectronics%20and%20Photonics.%20POLYTRONIC%202002.%20Conference%20Proceedings%20(Cat.%20No.02EX599)&rft.au=Marin,%20A.&rft.date=2002&rft.spage=17&rft.epage=21&rft.pages=17-21&rft.isbn=078037567X&rft.isbn_list=9780780375673&rft_id=info:doi/10.1109/POLYTR.2002.1020177&rft_dat=%3Cieee_6IE%3E1020177%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1020177&rfr_iscdi=true