Enhanced Foam Package Design for Drop/Impact Using Accurate Predictive Simulation

The interconnections and chips of the internal components of electronic devices need to be protected to prevent damage during shipping, handling, and daily use. This article studied an investigation into the abilities of foam as an outer packaging material to protect the detector device. This detect...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2023-05, Vol.13 (5), p.638-645
Hauptverfasser:	Yin, Pengcheng, Park, Seungbae, Jacob, Biju, Gowda, Arun
Format:	Artikel
Sprache:	eng
Schlagworte:	Circuit boards Damage prevention Deformation Deformation effects Dimpling Electric shock Electronic packaging Finite element method Foam packaging high-velocity drop impact Impact damage Impact prediction Mathematical models Moisture effects Numerical models Package design Packaging Predictive models Printed circuits Shape Sports Strain Stress-strain relationships Texture
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