Evaluation of interconnect technologies for power semiconductor devices

Electrical interconnection is an important part of device packaging. In packages of power semiconductor devices, wire bonding currently is the predominant interconnect technology; but other technologies such as flip chip, developed for IC chip packaging, and direct solder are being used in newly int...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Calata, J.N., Guo-Quan Lu, Luechinger, C.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Acoustic testing Bonding Electronics packaging Fabrication Integrated circuit packaging Power semiconductor devices Power system interconnection Power system reliability Semiconductor device packaging Wire
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