Effect of surface asperity truncation on thermal contact conductance
This paper presents studies on thermal contact conductance at light contact loads. Surface profilometry measurements are presented which show that actual surface asperity height distributions are not perfectly Gaussian. The highest asperities are truncated, leading the existing thermal contact condu...
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| creator | Milanez, F.H. Yovanovich, M.M. Culham, J.R. |
| description | This paper presents studies on thermal contact conductance at light contact loads. Surface profilometry measurements are presented which show that actual surface asperity height distributions are not perfectly Gaussian. The highest asperities are truncated, leading the existing thermal contact conductance models to underpredict experimental data. These observations have been incorporated into modifications of existing contact conductance models. The preliminary model has been compared against thermal contact conductance data presented in the open literature, and good agreement is observed. The truncation leads to an enhancement of thermal contact conductance at light contact pressures. The truncation is a function of the roughness level: the rougher the surface, the more truncated the surface height distribution. |
| doi_str_mv | 10.1109/ITHERM.2002.1012456 |
| format | Conference Proceeding |
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Surface profilometry measurements are presented which show that actual surface asperity height distributions are not perfectly Gaussian. The highest asperities are truncated, leading the existing thermal contact conductance models to underpredict experimental data. These observations have been incorporated into modifications of existing contact conductance models. The preliminary model has been compared against thermal contact conductance data presented in the open literature, and good agreement is observed. The truncation leads to an enhancement of thermal contact conductance at light contact pressures. The truncation is a function of the roughness level: the rougher the surface, the more truncated the surface height distribution.</description><identifier>ISSN: 1089-9870</identifier><identifier>ISBN: 0780371526</identifier><identifier>ISBN: 9780780371521</identifier><identifier>DOI: 10.1109/ITHERM.2002.1012456</identifier><language>eng</language><publisher>IEEE</publisher><subject>Deformable models ; Heat transfer ; Microelectronics ; Predictive models ; Rough surfaces ; Solid modeling ; Surface roughness ; Thermal conductivity ; Thermal engineering ; Thermal loading</subject><ispartof>ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. 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No.02CH37258)</title><addtitle>ITHERM</addtitle><description>This paper presents studies on thermal contact conductance at light contact loads. Surface profilometry measurements are presented which show that actual surface asperity height distributions are not perfectly Gaussian. The highest asperities are truncated, leading the existing thermal contact conductance models to underpredict experimental data. These observations have been incorporated into modifications of existing contact conductance models. The preliminary model has been compared against thermal contact conductance data presented in the open literature, and good agreement is observed. The truncation leads to an enhancement of thermal contact conductance at light contact pressures. The truncation is a function of the roughness level: the rougher the surface, the more truncated the surface height distribution.</description><subject>Deformable models</subject><subject>Heat transfer</subject><subject>Microelectronics</subject><subject>Predictive models</subject><subject>Rough surfaces</subject><subject>Solid modeling</subject><subject>Surface roughness</subject><subject>Thermal conductivity</subject><subject>Thermal engineering</subject><subject>Thermal loading</subject><issn>1089-9870</issn><isbn>0780371526</isbn><isbn>9780780371521</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2002</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj8FqAjEURQNtodb6BW7yAzN9ySSZvGWxtgpKodi1POMLnaIzksks_PsO1MuFszoXrhBzBaVSgC_r3Wr5tS01gC4VKG2suxNPUHuoamW1uxcTBR4L9DU8ilnf_8IYYw3YaiLeljFyyLKLsh9SpMCS-gunJl9lTkMbKDddK8fmH05nOsnQtZlGY-RxCJnawM_iIdKp59mNU_H9vtwtVsXm82O9eN0UjdaQixB9TVXQ2h4JDt440KycC5YYtSZEr4Ei2hARgwkYIxlG673Dg1ORq6mY_-82zLy_pOZM6bq_na7-ACT6TD0</recordid><startdate>2002</startdate><enddate>2002</enddate><creator>Milanez, F.H.</creator><creator>Yovanovich, M.M.</creator><creator>Culham, J.R.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2002</creationdate><title>Effect of surface asperity truncation on thermal contact conductance</title><author>Milanez, F.H. ; Yovanovich, M.M. ; Culham, J.R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i220t-cf87a3c225da0b84602e166c5ae922a99820af95cf99c4c9ffa4e958869b61fe3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Deformable models</topic><topic>Heat transfer</topic><topic>Microelectronics</topic><topic>Predictive models</topic><topic>Rough surfaces</topic><topic>Solid modeling</topic><topic>Surface roughness</topic><topic>Thermal conductivity</topic><topic>Thermal engineering</topic><topic>Thermal loading</topic><toplevel>online_resources</toplevel><creatorcontrib>Milanez, F.H.</creatorcontrib><creatorcontrib>Yovanovich, M.M.</creatorcontrib><creatorcontrib>Culham, J.R.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Milanez, F.H.</au><au>Yovanovich, M.M.</au><au>Culham, J.R.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Effect of surface asperity truncation on thermal contact conductance</atitle><btitle>ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)</btitle><stitle>ITHERM</stitle><date>2002</date><risdate>2002</risdate><spage>186</spage><epage>192</epage><pages>186-192</pages><issn>1089-9870</issn><isbn>0780371526</isbn><isbn>9780780371521</isbn><abstract>This paper presents studies on thermal contact conductance at light contact loads. Surface profilometry measurements are presented which show that actual surface asperity height distributions are not perfectly Gaussian. The highest asperities are truncated, leading the existing thermal contact conductance models to underpredict experimental data. These observations have been incorporated into modifications of existing contact conductance models. The preliminary model has been compared against thermal contact conductance data presented in the open literature, and good agreement is observed. The truncation leads to an enhancement of thermal contact conductance at light contact pressures. The truncation is a function of the roughness level: the rougher the surface, the more truncated the surface height distribution.</abstract><pub>IEEE</pub><doi>10.1109/ITHERM.2002.1012456</doi><tpages>7</tpages><oa>free_for_read</oa></addata></record> |
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| ispartof | ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), 2002, p.186-192 |
| issn | 1089-9870 |
| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Deformable models Heat transfer Microelectronics Predictive models Rough surfaces Solid modeling Surface roughness Thermal conductivity Thermal engineering Thermal loading |
| title | Effect of surface asperity truncation on thermal contact conductance |
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