Suppression of multi-path couplings in MCM with a flip-chipped SiGe-MMIC
Techniques to obtain a high isolation property in a multi-chip module (MCM) between pads of a SiGe-MMIC flip-chipped on a low temperature co-fired ceramic (LTCC) are discussed. In such an MCM, there are two coupling paths. One is a path through the LTCC and the other is a path through the MMIC. To i...
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| creator | Nishino, T. Maeda, K. Shimozawa, M. Ikushima, T. Sadahiro, K. Katsura, T. Suematsu, N. Itoh, K. Oohashi, H. Takagi, T. Ishida, O. |
| description | Techniques to obtain a high isolation property in a multi-chip module (MCM) between pads of a SiGe-MMIC flip-chipped on a low temperature co-fired ceramic (LTCC) are discussed. In such an MCM, there are two coupling paths. One is a path through the LTCC and the other is a path through the MMIC. To improve the total isolation property, structures to reduce the two coupling paths are required because the paths of such leakage are not in series but in parallel. We examined the disposition of several kinds of ground patterns on the LTCC. Also, we devised a metal plate on a bias circuit as a shielding structure on the SiGe-MMIC. The effectiveness of the isolating structures was verified by measuring IIP2 in a receiver MCM with a direct conversion SiGe-MMIC. The IIP2 property has been improved successfully as well as the isolation property. |
| doi_str_mv | 10.1109/MWSYM.2002.1012113 |
| format | Conference Proceeding |
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The IIP2 property has been improved successfully as well as the isolation property.</description><subject>Business communication</subject><subject>Circuit simulation</subject><subject>Costs</subject><subject>Coupling circuits</subject><subject>Information technology</subject><subject>MMICs</subject><subject>Mobile communication</subject><subject>Research and development</subject><subject>Substrates</subject><subject>Temperature</subject><issn>0149-645X</issn><issn>2576-7216</issn><isbn>9780780372399</isbn><isbn>0780372395</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2002</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotUF9LwzAcDP4Bx9wX0Jc8-ZaZX5I2zaMU3QYrPkxRn0rW_uIiXRubFvHbW5jHwcFxHNwRcgN8CcDNffG2-yiWgnOxBA4CQJ6RmUh0yrSA9JwsjM74RKmFNOaCzDgow1KVvF-RRYxffIJKuOFyRta7MYQeY_RdSztHj2MzeBbscKBVN4bGt5-R-pYWeUF__ORa6hofWHXwIWBNd36FrCg2-TW5dLaJuPjXOXl9enzJ12z7vNrkD1vmBVcDk04Lt5fSZTq1SmRgtUOrVKLSRCtEIYVNAfaASa21A8DMcFdxiXtl6lrLObk79Ya--x4xDuXRxwqbxrbYjbEUelrNMzUFb09Bj4hl6P3R9r_l_2HyD_mEWz0</recordid><startdate>2002</startdate><enddate>2002</enddate><creator>Nishino, T.</creator><creator>Maeda, K.</creator><creator>Shimozawa, M.</creator><creator>Ikushima, T.</creator><creator>Sadahiro, K.</creator><creator>Katsura, T.</creator><creator>Suematsu, N.</creator><creator>Itoh, K.</creator><creator>Oohashi, H.</creator><creator>Takagi, T.</creator><creator>Ishida, O.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>2002</creationdate><title>Suppression of multi-path couplings in MCM with a flip-chipped SiGe-MMIC</title><author>Nishino, T. ; Maeda, K. ; Shimozawa, M. ; Ikushima, T. ; Sadahiro, K. ; Katsura, T. ; Suematsu, N. ; Itoh, K. ; Oohashi, H. ; Takagi, T. ; Ishida, O.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i204t-3f72fb33f876a4281a7fea44546574ee232a611b1e5d77f11e890fc03eb49dd73</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Business communication</topic><topic>Circuit simulation</topic><topic>Costs</topic><topic>Coupling circuits</topic><topic>Information technology</topic><topic>MMICs</topic><topic>Mobile communication</topic><topic>Research and development</topic><topic>Substrates</topic><topic>Temperature</topic><toplevel>online_resources</toplevel><creatorcontrib>Nishino, T.</creatorcontrib><creatorcontrib>Maeda, K.</creatorcontrib><creatorcontrib>Shimozawa, M.</creatorcontrib><creatorcontrib>Ikushima, T.</creatorcontrib><creatorcontrib>Sadahiro, K.</creatorcontrib><creatorcontrib>Katsura, T.</creatorcontrib><creatorcontrib>Suematsu, N.</creatorcontrib><creatorcontrib>Itoh, K.</creatorcontrib><creatorcontrib>Oohashi, H.</creatorcontrib><creatorcontrib>Takagi, T.</creatorcontrib><creatorcontrib>Ishida, O.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Nishino, T.</au><au>Maeda, K.</au><au>Shimozawa, M.</au><au>Ikushima, T.</au><au>Sadahiro, K.</au><au>Katsura, T.</au><au>Suematsu, N.</au><au>Itoh, K.</au><au>Oohashi, H.</au><au>Takagi, T.</au><au>Ishida, O.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Suppression of multi-path couplings in MCM with a flip-chipped SiGe-MMIC</atitle><btitle>2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278)</btitle><stitle>MWSYM</stitle><date>2002</date><risdate>2002</risdate><volume>3</volume><spage>1385</spage><epage>1388 vol.3</epage><pages>1385-1388 vol.3</pages><issn>0149-645X</issn><eissn>2576-7216</eissn><isbn>9780780372399</isbn><isbn>0780372395</isbn><abstract>Techniques to obtain a high isolation property in a multi-chip module (MCM) between pads of a SiGe-MMIC flip-chipped on a low temperature co-fired ceramic (LTCC) are discussed. In such an MCM, there are two coupling paths. One is a path through the LTCC and the other is a path through the MMIC. To improve the total isolation property, structures to reduce the two coupling paths are required because the paths of such leakage are not in series but in parallel. We examined the disposition of several kinds of ground patterns on the LTCC. Also, we devised a metal plate on a bias circuit as a shielding structure on the SiGe-MMIC. The effectiveness of the isolating structures was verified by measuring IIP2 in a receiver MCM with a direct conversion SiGe-MMIC. The IIP2 property has been improved successfully as well as the isolation property.</abstract><pub>IEEE</pub><doi>10.1109/MWSYM.2002.1012113</doi><tpages>4</tpages></addata></record> |
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| identifier | ISSN: 0149-645X |
| ispartof | 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278), 2002, Vol.3, p.1385-1388 vol.3 |
| issn | 0149-645X 2576-7216 |
| language | eng |
| recordid | cdi_ieee_primary_1012113 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Business communication Circuit simulation Costs Coupling circuits Information technology MMICs Mobile communication Research and development Substrates Temperature |
| title | Suppression of multi-path couplings in MCM with a flip-chipped SiGe-MMIC |
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