Large Scale Terahertz Sensor Array Module with Antenna Coupled Microbolometers on Glass Substrate with Sigma Delta ADC Readout ASIC
We describe the design, fabrication and demonstration of a terahertz sensor array module, designed to operate over 250-350GHz. The antenna coupled microbolometer was fabricated on a glass substrate with an integrated array of pixel switches and row multiplexing circuitry implemented with LTPS (Low T...
Gespeichert in:
Veröffentlicht in: | IEEE transactions on terahertz science and technology 2023-05, Vol.13 (3), p.1-9 |
---|---|
Hauptverfasser: | , , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | 9 |
---|---|
container_issue | 3 |
container_start_page | 1 |
container_title | IEEE transactions on terahertz science and technology |
container_volume | 13 |
creator | Hong, John Andrews, Sean Bos, Jan Chan, Edward Chang, Tallis Condito, Vincent Lewis, Alan Pessatti, Murilo Ryu, Seung Tak Shin, Heesun Wen, Bing |
description | We describe the design, fabrication and demonstration of a terahertz sensor array module, designed to operate over 250-350GHz. The antenna coupled microbolometer was fabricated on a glass substrate with an integrated array of pixel switches and row multiplexing circuitry implemented with LTPS (Low Temperature PolySilicon) thin film transistors. While other microbolometer arrays have been reported for the upper Terahertz bands, we focus on lower frequencies where adequate semiconductor sources are available potentially enabling important medical and security applications. The devices were fabricated in a Gen 3.5 flat panel manufacturing facility implementing what we call Large Area MEMS Platform (LAMP) surface micromachining process, providing a path to low-cost manufacturing. Individual pixels were defined on a 0.7mm pitch across an array of 128x128 pixels in this first demonstration. Since flat panel fabrication capabilities use large, single-shot reticle masks and large glass substrates, physically larger arrays can be manufactured without mask stitching. An ROIC (readout integrated circuit) was demonstrated to support the THz sensor panel with 648 input channels, each providing an independent sigma delta ADC with excellent uniformity and 12 effective number of bits. An early demonstration of the sensor array is described, imaging a metallic knife hidden in a cardboard envelope. |
doi_str_mv | 10.1109/TTHZ.2023.3263629 |
format | Article |
fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_ieee_primary_10092899</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>10092899</ieee_id><sourcerecordid>2808828726</sourcerecordid><originalsourceid>FETCH-LOGICAL-c294t-325786caf376ea6eff64bef65e1a8eaa0cb419bc55fbd29909674724f1c364193</originalsourceid><addsrcrecordid>eNpNkE9Lw0AQxRdRsFQ_gOBhwXPr_kk22WOI2goVwUQQL2GSTtqUNFt3N4he_eKmtIhzmYH33gzzI-SKsynnTN_m-fx9KpiQUymUVEKfkJHgoZrIIFCnf7N4OyeXzm3YUKGScRSMyM8C7AppVkGLNEcLa7T-m2bYOWNpYi180Sez7Af1s_FrmnQeuw5oavpdi0v61FTWlKY1W_RoHTUdnbXgHM360nkL_pjLmtUW6B22Hmhyl9IXhKXpPU2yx_SCnNXQOrw89jF5fbjP0_lk8Tx7TJPFpBI68BMpwihWFdQyUggK61oFJdYqRA4xArCqDLguqzCsy6XQmmkVBZEIal5JNShyTG4Oe3fWfPTofLExve2Gk4WIWRyLOBrwjQk_uIbHnLNYFzvbbMF-FZwVe9zFHnexx10ccQ-Z60OmQcR_fqZFrLX8BafBfE4</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2808828726</pqid></control><display><type>article</type><title>Large Scale Terahertz Sensor Array Module with Antenna Coupled Microbolometers on Glass Substrate with Sigma Delta ADC Readout ASIC</title><source>IEEE Electronic Library (IEL)</source><creator>Hong, John ; Andrews, Sean ; Bos, Jan ; Chan, Edward ; Chang, Tallis ; Condito, Vincent ; Lewis, Alan ; Pessatti, Murilo ; Ryu, Seung Tak ; Shin, Heesun ; Wen, Bing</creator><creatorcontrib>Hong, John ; Andrews, Sean ; Bos, Jan ; Chan, Edward ; Chang, Tallis ; Condito, Vincent ; Lewis, Alan ; Pessatti, Murilo ; Ryu, Seung Tak ; Shin, Heesun ; Wen, Bing</creatorcontrib><description>We describe the design, fabrication and demonstration of a terahertz sensor array module, designed to operate over 250-350GHz. The antenna coupled microbolometer was fabricated on a glass substrate with an integrated array of pixel switches and row multiplexing circuitry implemented with LTPS (Low Temperature PolySilicon) thin film transistors. While other microbolometer arrays have been reported for the upper Terahertz bands, we focus on lower frequencies where adequate semiconductor sources are available potentially enabling important medical and security applications. The devices were fabricated in a Gen 3.5 flat panel manufacturing facility implementing what we call Large Area MEMS Platform (LAMP) surface micromachining process, providing a path to low-cost manufacturing. Individual pixels were defined on a 0.7mm pitch across an array of 128x128 pixels in this first demonstration. Since flat panel fabrication capabilities use large, single-shot reticle masks and large glass substrates, physically larger arrays can be manufactured without mask stitching. An ROIC (readout integrated circuit) was demonstrated to support the THz sensor panel with 648 input channels, each providing an independent sigma delta ADC with excellent uniformity and 12 effective number of bits. An early demonstration of the sensor array is described, imaging a metallic knife hidden in a cardboard envelope.</description><identifier>ISSN: 2156-342X</identifier><identifier>EISSN: 2156-3446</identifier><identifier>DOI: 10.1109/TTHZ.2023.3263629</identifier><identifier>CODEN: ITTSBX</identifier><language>eng</language><publisher>Piscataway: IEEE</publisher><subject>Analog to digital converters ; Antenna arrays ; Antennas ; Array ; Camera ; Cardboard ; Circuits ; Dipole antennas ; Flat panels ; Glass ; Glass substrates ; Imaging ; Integrated circuits ; Large Pixels ; Low temperature ; Manufacturing ; Microbolometer ; Microelectromechanical systems ; Micromachining ; Modules ; Multiplexing ; Pixels ; Polysilicon ; Reflector antennas ; Semiconductor devices ; Sensor arrays ; Sensors ; Stitching ; Substrates ; Switches ; Terahertz ; Terahertz frequencies ; Thin film transistors</subject><ispartof>IEEE transactions on terahertz science and technology, 2023-05, Vol.13 (3), p.1-9</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2023</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c294t-325786caf376ea6eff64bef65e1a8eaa0cb419bc55fbd29909674724f1c364193</citedby><cites>FETCH-LOGICAL-c294t-325786caf376ea6eff64bef65e1a8eaa0cb419bc55fbd29909674724f1c364193</cites><orcidid>0000-0003-4016-7844 ; 0000-0002-3992-7124 ; 0000-0001-9152-1511 ; 0000-0003-2105-9813 ; 0000-0002-6696-7316 ; 0000-0001-9204-2109</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/10092899$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/10092899$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Hong, John</creatorcontrib><creatorcontrib>Andrews, Sean</creatorcontrib><creatorcontrib>Bos, Jan</creatorcontrib><creatorcontrib>Chan, Edward</creatorcontrib><creatorcontrib>Chang, Tallis</creatorcontrib><creatorcontrib>Condito, Vincent</creatorcontrib><creatorcontrib>Lewis, Alan</creatorcontrib><creatorcontrib>Pessatti, Murilo</creatorcontrib><creatorcontrib>Ryu, Seung Tak</creatorcontrib><creatorcontrib>Shin, Heesun</creatorcontrib><creatorcontrib>Wen, Bing</creatorcontrib><title>Large Scale Terahertz Sensor Array Module with Antenna Coupled Microbolometers on Glass Substrate with Sigma Delta ADC Readout ASIC</title><title>IEEE transactions on terahertz science and technology</title><addtitle>TTHZ</addtitle><description>We describe the design, fabrication and demonstration of a terahertz sensor array module, designed to operate over 250-350GHz. The antenna coupled microbolometer was fabricated on a glass substrate with an integrated array of pixel switches and row multiplexing circuitry implemented with LTPS (Low Temperature PolySilicon) thin film transistors. While other microbolometer arrays have been reported for the upper Terahertz bands, we focus on lower frequencies where adequate semiconductor sources are available potentially enabling important medical and security applications. The devices were fabricated in a Gen 3.5 flat panel manufacturing facility implementing what we call Large Area MEMS Platform (LAMP) surface micromachining process, providing a path to low-cost manufacturing. Individual pixels were defined on a 0.7mm pitch across an array of 128x128 pixels in this first demonstration. Since flat panel fabrication capabilities use large, single-shot reticle masks and large glass substrates, physically larger arrays can be manufactured without mask stitching. An ROIC (readout integrated circuit) was demonstrated to support the THz sensor panel with 648 input channels, each providing an independent sigma delta ADC with excellent uniformity and 12 effective number of bits. An early demonstration of the sensor array is described, imaging a metallic knife hidden in a cardboard envelope.</description><subject>Analog to digital converters</subject><subject>Antenna arrays</subject><subject>Antennas</subject><subject>Array</subject><subject>Camera</subject><subject>Cardboard</subject><subject>Circuits</subject><subject>Dipole antennas</subject><subject>Flat panels</subject><subject>Glass</subject><subject>Glass substrates</subject><subject>Imaging</subject><subject>Integrated circuits</subject><subject>Large Pixels</subject><subject>Low temperature</subject><subject>Manufacturing</subject><subject>Microbolometer</subject><subject>Microelectromechanical systems</subject><subject>Micromachining</subject><subject>Modules</subject><subject>Multiplexing</subject><subject>Pixels</subject><subject>Polysilicon</subject><subject>Reflector antennas</subject><subject>Semiconductor devices</subject><subject>Sensor arrays</subject><subject>Sensors</subject><subject>Stitching</subject><subject>Substrates</subject><subject>Switches</subject><subject>Terahertz</subject><subject>Terahertz frequencies</subject><subject>Thin film transistors</subject><issn>2156-342X</issn><issn>2156-3446</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpNkE9Lw0AQxRdRsFQ_gOBhwXPr_kk22WOI2goVwUQQL2GSTtqUNFt3N4he_eKmtIhzmYH33gzzI-SKsynnTN_m-fx9KpiQUymUVEKfkJHgoZrIIFCnf7N4OyeXzm3YUKGScRSMyM8C7AppVkGLNEcLa7T-m2bYOWNpYi180Sez7Af1s_FrmnQeuw5oavpdi0v61FTWlKY1W_RoHTUdnbXgHM360nkL_pjLmtUW6B22Hmhyl9IXhKXpPU2yx_SCnNXQOrw89jF5fbjP0_lk8Tx7TJPFpBI68BMpwihWFdQyUggK61oFJdYqRA4xArCqDLguqzCsy6XQmmkVBZEIal5JNShyTG4Oe3fWfPTofLExve2Gk4WIWRyLOBrwjQk_uIbHnLNYFzvbbMF-FZwVe9zFHnexx10ccQ-Z60OmQcR_fqZFrLX8BafBfE4</recordid><startdate>20230501</startdate><enddate>20230501</enddate><creator>Hong, John</creator><creator>Andrews, Sean</creator><creator>Bos, Jan</creator><creator>Chan, Edward</creator><creator>Chang, Tallis</creator><creator>Condito, Vincent</creator><creator>Lewis, Alan</creator><creator>Pessatti, Murilo</creator><creator>Ryu, Seung Tak</creator><creator>Shin, Heesun</creator><creator>Wen, Bing</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0003-4016-7844</orcidid><orcidid>https://orcid.org/0000-0002-3992-7124</orcidid><orcidid>https://orcid.org/0000-0001-9152-1511</orcidid><orcidid>https://orcid.org/0000-0003-2105-9813</orcidid><orcidid>https://orcid.org/0000-0002-6696-7316</orcidid><orcidid>https://orcid.org/0000-0001-9204-2109</orcidid></search><sort><creationdate>20230501</creationdate><title>Large Scale Terahertz Sensor Array Module with Antenna Coupled Microbolometers on Glass Substrate with Sigma Delta ADC Readout ASIC</title><author>Hong, John ; Andrews, Sean ; Bos, Jan ; Chan, Edward ; Chang, Tallis ; Condito, Vincent ; Lewis, Alan ; Pessatti, Murilo ; Ryu, Seung Tak ; Shin, Heesun ; Wen, Bing</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c294t-325786caf376ea6eff64bef65e1a8eaa0cb419bc55fbd29909674724f1c364193</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Analog to digital converters</topic><topic>Antenna arrays</topic><topic>Antennas</topic><topic>Array</topic><topic>Camera</topic><topic>Cardboard</topic><topic>Circuits</topic><topic>Dipole antennas</topic><topic>Flat panels</topic><topic>Glass</topic><topic>Glass substrates</topic><topic>Imaging</topic><topic>Integrated circuits</topic><topic>Large Pixels</topic><topic>Low temperature</topic><topic>Manufacturing</topic><topic>Microbolometer</topic><topic>Microelectromechanical systems</topic><topic>Micromachining</topic><topic>Modules</topic><topic>Multiplexing</topic><topic>Pixels</topic><topic>Polysilicon</topic><topic>Reflector antennas</topic><topic>Semiconductor devices</topic><topic>Sensor arrays</topic><topic>Sensors</topic><topic>Stitching</topic><topic>Substrates</topic><topic>Switches</topic><topic>Terahertz</topic><topic>Terahertz frequencies</topic><topic>Thin film transistors</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Hong, John</creatorcontrib><creatorcontrib>Andrews, Sean</creatorcontrib><creatorcontrib>Bos, Jan</creatorcontrib><creatorcontrib>Chan, Edward</creatorcontrib><creatorcontrib>Chang, Tallis</creatorcontrib><creatorcontrib>Condito, Vincent</creatorcontrib><creatorcontrib>Lewis, Alan</creatorcontrib><creatorcontrib>Pessatti, Murilo</creatorcontrib><creatorcontrib>Ryu, Seung Tak</creatorcontrib><creatorcontrib>Shin, Heesun</creatorcontrib><creatorcontrib>Wen, Bing</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on terahertz science and technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hong, John</au><au>Andrews, Sean</au><au>Bos, Jan</au><au>Chan, Edward</au><au>Chang, Tallis</au><au>Condito, Vincent</au><au>Lewis, Alan</au><au>Pessatti, Murilo</au><au>Ryu, Seung Tak</au><au>Shin, Heesun</au><au>Wen, Bing</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Large Scale Terahertz Sensor Array Module with Antenna Coupled Microbolometers on Glass Substrate with Sigma Delta ADC Readout ASIC</atitle><jtitle>IEEE transactions on terahertz science and technology</jtitle><stitle>TTHZ</stitle><date>2023-05-01</date><risdate>2023</risdate><volume>13</volume><issue>3</issue><spage>1</spage><epage>9</epage><pages>1-9</pages><issn>2156-342X</issn><eissn>2156-3446</eissn><coden>ITTSBX</coden><abstract>We describe the design, fabrication and demonstration of a terahertz sensor array module, designed to operate over 250-350GHz. The antenna coupled microbolometer was fabricated on a glass substrate with an integrated array of pixel switches and row multiplexing circuitry implemented with LTPS (Low Temperature PolySilicon) thin film transistors. While other microbolometer arrays have been reported for the upper Terahertz bands, we focus on lower frequencies where adequate semiconductor sources are available potentially enabling important medical and security applications. The devices were fabricated in a Gen 3.5 flat panel manufacturing facility implementing what we call Large Area MEMS Platform (LAMP) surface micromachining process, providing a path to low-cost manufacturing. Individual pixels were defined on a 0.7mm pitch across an array of 128x128 pixels in this first demonstration. Since flat panel fabrication capabilities use large, single-shot reticle masks and large glass substrates, physically larger arrays can be manufactured without mask stitching. An ROIC (readout integrated circuit) was demonstrated to support the THz sensor panel with 648 input channels, each providing an independent sigma delta ADC with excellent uniformity and 12 effective number of bits. An early demonstration of the sensor array is described, imaging a metallic knife hidden in a cardboard envelope.</abstract><cop>Piscataway</cop><pub>IEEE</pub><doi>10.1109/TTHZ.2023.3263629</doi><tpages>9</tpages><orcidid>https://orcid.org/0000-0003-4016-7844</orcidid><orcidid>https://orcid.org/0000-0002-3992-7124</orcidid><orcidid>https://orcid.org/0000-0001-9152-1511</orcidid><orcidid>https://orcid.org/0000-0003-2105-9813</orcidid><orcidid>https://orcid.org/0000-0002-6696-7316</orcidid><orcidid>https://orcid.org/0000-0001-9204-2109</orcidid></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | ISSN: 2156-342X |
ispartof | IEEE transactions on terahertz science and technology, 2023-05, Vol.13 (3), p.1-9 |
issn | 2156-342X 2156-3446 |
language | eng |
recordid | cdi_ieee_primary_10092899 |
source | IEEE Electronic Library (IEL) |
subjects | Analog to digital converters Antenna arrays Antennas Array Camera Cardboard Circuits Dipole antennas Flat panels Glass Glass substrates Imaging Integrated circuits Large Pixels Low temperature Manufacturing Microbolometer Microelectromechanical systems Micromachining Modules Multiplexing Pixels Polysilicon Reflector antennas Semiconductor devices Sensor arrays Sensors Stitching Substrates Switches Terahertz Terahertz frequencies Thin film transistors |
title | Large Scale Terahertz Sensor Array Module with Antenna Coupled Microbolometers on Glass Substrate with Sigma Delta ADC Readout ASIC |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-11T07%3A39%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Large%20Scale%20Terahertz%20Sensor%20Array%20Module%20with%20Antenna%20Coupled%20Microbolometers%20on%20Glass%20Substrate%20with%20Sigma%20Delta%20ADC%20Readout%20ASIC&rft.jtitle=IEEE%20transactions%20on%20terahertz%20science%20and%20technology&rft.au=Hong,%20John&rft.date=2023-05-01&rft.volume=13&rft.issue=3&rft.spage=1&rft.epage=9&rft.pages=1-9&rft.issn=2156-342X&rft.eissn=2156-3446&rft.coden=ITTSBX&rft_id=info:doi/10.1109/TTHZ.2023.3263629&rft_dat=%3Cproquest_RIE%3E2808828726%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2808828726&rft_id=info:pmid/&rft_ieee_id=10092899&rfr_iscdi=true |