Edge Word-Line Reliability Problem in 3-D NAND Flash Memory: Observations, Analysis, and Solutions
The 3-D flash memory is gradually becoming the mainstream nonvolatile storage medium due to its high capacity and high performance. However, interlayer interference during 3-D flash programming leads to significant differences in the error characteristics of edge and inner word lines; interlayer int...
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Veröffentlicht in: | IEEE transactions on very large scale integration (VLSI) systems 2023-06, Vol.31 (6), p.1-13 |
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creator | Wei, Debao Feng, Hua Liu, Ming Song, Yu Piao, Zhelong Hu, Cong Qiao, Liyan |
description | The 3-D flash memory is gradually becoming the mainstream nonvolatile storage medium due to its high capacity and high performance. However, interlayer interference during 3-D flash programming leads to significant differences in the error characteristics of edge and inner word lines; interlayer interference becomes more pronounced as the number of stacked layers increases, seriously affecting data storage reliability. In this study, many actual tests were conducted on triple-level cell (TLC) and quad-level cell (QLC) flash memory, which are the mainstream storage media in the current consumer market, to obtain the edge and inner word-line threshold voltage data under the interference of different factors, such as retention loss and read disturb; then, the threshold voltage difference between the edge and inner word lines under different conditions was quantitatively analyzed. An edge word-line reliability optimization strategy is proposed based on the read-reference voltage extra offset (RRVEO). Experimental results show that this strategy can reduce the edge word-line raw bit error rate (RBER) by more than 90% and eliminate the reliability difference between inner and edge word lines without significant overhead, thus significantly improving the data storage reliability of flash memory. |
doi_str_mv | 10.1109/TVLSI.2023.3249183 |
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However, interlayer interference during 3-D flash programming leads to significant differences in the error characteristics of edge and inner word lines; interlayer interference becomes more pronounced as the number of stacked layers increases, seriously affecting data storage reliability. In this study, many actual tests were conducted on triple-level cell (TLC) and quad-level cell (QLC) flash memory, which are the mainstream storage media in the current consumer market, to obtain the edge and inner word-line threshold voltage data under the interference of different factors, such as retention loss and read disturb; then, the threshold voltage difference between the edge and inner word lines under different conditions was quantitatively analyzed. An edge word-line reliability optimization strategy is proposed based on the read-reference voltage extra offset (RRVEO). Experimental results show that this strategy can reduce the edge word-line raw bit error rate (RBER) by more than 90% and eliminate the reliability difference between inner and edge word lines without significant overhead, thus significantly improving the data storage reliability of flash memory.</description><identifier>ISSN: 1063-8210</identifier><identifier>EISSN: 1557-9999</identifier><identifier>DOI: 10.1109/TVLSI.2023.3249183</identifier><identifier>CODEN: ITCOB4</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Bit error rate ; Calibration ; Data storage ; Edge word line ; Flash memories ; Flash memory (computers) ; Interference ; Interlayers ; nand flash ; open block ; Optimization ; Programming ; quad-level cell (QLC) ; read-reference voltage (RRV) ; Reliability ; storage reliability ; Threshold voltage</subject><ispartof>IEEE transactions on very large scale integration (VLSI) systems, 2023-06, Vol.31 (6), p.1-13</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2023</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c296t-345f10ff956e387fa280a11e00d0dd2b45caa6226b7a2ba7fe11e47c29a3529c3</citedby><cites>FETCH-LOGICAL-c296t-345f10ff956e387fa280a11e00d0dd2b45caa6226b7a2ba7fe11e47c29a3529c3</cites><orcidid>0000-0001-6353-1384 ; 0000-0002-8364-2062 ; 0000-0002-8220-7990</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/10089474$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/10089474$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Wei, Debao</creatorcontrib><creatorcontrib>Feng, Hua</creatorcontrib><creatorcontrib>Liu, Ming</creatorcontrib><creatorcontrib>Song, Yu</creatorcontrib><creatorcontrib>Piao, Zhelong</creatorcontrib><creatorcontrib>Hu, Cong</creatorcontrib><creatorcontrib>Qiao, Liyan</creatorcontrib><title>Edge Word-Line Reliability Problem in 3-D NAND Flash Memory: Observations, Analysis, and Solutions</title><title>IEEE transactions on very large scale integration (VLSI) systems</title><addtitle>TVLSI</addtitle><description>The 3-D flash memory is gradually becoming the mainstream nonvolatile storage medium due to its high capacity and high performance. However, interlayer interference during 3-D flash programming leads to significant differences in the error characteristics of edge and inner word lines; interlayer interference becomes more pronounced as the number of stacked layers increases, seriously affecting data storage reliability. In this study, many actual tests were conducted on triple-level cell (TLC) and quad-level cell (QLC) flash memory, which are the mainstream storage media in the current consumer market, to obtain the edge and inner word-line threshold voltage data under the interference of different factors, such as retention loss and read disturb; then, the threshold voltage difference between the edge and inner word lines under different conditions was quantitatively analyzed. An edge word-line reliability optimization strategy is proposed based on the read-reference voltage extra offset (RRVEO). Experimental results show that this strategy can reduce the edge word-line raw bit error rate (RBER) by more than 90% and eliminate the reliability difference between inner and edge word lines without significant overhead, thus significantly improving the data storage reliability of flash memory.</description><subject>Bit error rate</subject><subject>Calibration</subject><subject>Data storage</subject><subject>Edge word line</subject><subject>Flash memories</subject><subject>Flash memory (computers)</subject><subject>Interference</subject><subject>Interlayers</subject><subject>nand flash</subject><subject>open block</subject><subject>Optimization</subject><subject>Programming</subject><subject>quad-level cell (QLC)</subject><subject>read-reference voltage (RRV)</subject><subject>Reliability</subject><subject>storage reliability</subject><subject>Threshold voltage</subject><issn>1063-8210</issn><issn>1557-9999</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpNkEtLAzEUhYMoWKt_QFwE3Do1r3nEXbGtFsZWbNVlyMxkNCWd1GQqzL83fSy8m3vgnHO5fABcYzTAGPH75Ue-mA4IInRACeM4oyegh-M4jXiY06BRQqOMYHQOLrxfIYQZ46gHinH1peCndVWU60bBN2W0LLTRbQdfnS2MWkPdQBqN4Gw4G8GJkf4bvqi1dd0DnBdeuV_Zatv4OzhspOm8Dko2FVxYs90bl-Cslsarq-Pug_fJePn4HOXzp-njMI9KwpM2oiyuMaprHieKZmktSYYkxgqhClUVKVhcSpkQkhSpJIVMaxVMloaypDHhJe2D28PdjbM_W-VbsbJbF37ygmQ4TjJGMQspckiVznrvVC02Tq-l6wRGYsdS7FmKHUtxZBlKN4eSVkr9K6CMs5TRP281byQ</recordid><startdate>20230601</startdate><enddate>20230601</enddate><creator>Wei, Debao</creator><creator>Feng, Hua</creator><creator>Liu, Ming</creator><creator>Song, Yu</creator><creator>Piao, Zhelong</creator><creator>Hu, Cong</creator><creator>Qiao, Liyan</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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However, interlayer interference during 3-D flash programming leads to significant differences in the error characteristics of edge and inner word lines; interlayer interference becomes more pronounced as the number of stacked layers increases, seriously affecting data storage reliability. In this study, many actual tests were conducted on triple-level cell (TLC) and quad-level cell (QLC) flash memory, which are the mainstream storage media in the current consumer market, to obtain the edge and inner word-line threshold voltage data under the interference of different factors, such as retention loss and read disturb; then, the threshold voltage difference between the edge and inner word lines under different conditions was quantitatively analyzed. An edge word-line reliability optimization strategy is proposed based on the read-reference voltage extra offset (RRVEO). 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subjects | Bit error rate Calibration Data storage Edge word line Flash memories Flash memory (computers) Interference Interlayers nand flash open block Optimization Programming quad-level cell (QLC) read-reference voltage (RRV) Reliability storage reliability Threshold voltage |
title | Edge Word-Line Reliability Problem in 3-D NAND Flash Memory: Observations, Analysis, and Solutions |
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