4x100Gb/s PAM4 Multi-Channel Silicon Photonic Chipset with Hybrid Integration of III-V DFB Lasers and Electro-Absorption Modulators

A silicon photonic based transmitter and receiver chipset for 4x106Gb/s 400GBASE-DR4 data rates is presented. Each channel of the transmitter chip reaches high extinction ratio and optical modulation amplitude (OMA) with a low TDECQ penalty in full compliance with the IEEE standard. The receiver chi...

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Veröffentlicht in:	Journal of lightwave technology 2023-08, p.1-10
Hauptverfasser:	Levy, Jacob S., Timurdogan, Erman, Kuo, Yu-Sheng, Lyu, Gap Youl, Tsai, Charles, Yan, Xuejin, Kim, Harqkyun, Stagarescu, Cristian, Meneou, Kevin, Thomas, Abu, Fragkos, Ioannis, Sitwell, Geoffrey, Trita, Andrea, Liu, Yangyang, Ziebel, Melissa, Byrd, Jerry, Steinbach, Sven, Chou, Bruce, Vis, William, Abed, Arin, Kwon, Young, Nykanen, Henri, Lo, Shih-Han, Ikonen, Janne, Larismaa, Juha, Drake, John, Benzoni, Albert, Minkenberg, Cyriel, Schrans, Thomas, Rickman, Andrew
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonding Datacenter distributed feedback laser (DFB) Electro-absorption modulators (EAM) Optical fiber polarization Optical fiber sensors Optical fibers Optical polarization Optical receivers Optical transmitters pulse-amplitdue modulation (PAM)-4 Silicon photonics
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