Understanding lead frame surface treatment and its impact on package reliability

Lead frame micro-electronic packages are still the most widely used in the semiconductor industry. The surface properties of metal lead frames are involved in several important interfacial interactions within micro-electronic packages and hence have crucial impact on package integrity and reliabilit...

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Bibliographische Detailangaben
Hauptverfasser:	Renyi Wang, Kuder, R., Bing Wu, Emmerson, G.T., Seeley, G.J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Chemicals Design. Technologies. Operation analysis. Testing Electronics Electronics industry Exact sciences and technology Integrated circuits Lead compounds Mass spectroscopy Microassembly Nuclear magnetic resonance Optical microscopy Particle beam optics Semiconductor device packaging Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Surface treatment Testing, measurement, noise and reliability
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