Understanding lead frame surface treatment and its impact on package reliability
Lead frame micro-electronic packages are still the most widely used in the semiconductor industry. The surface properties of metal lead frames are involved in several important interfacial interactions within micro-electronic packages and hence have crucial impact on package integrity and reliabilit...
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| creator | Renyi Wang Kuder, R. Bing Wu Emmerson, G.T. Seeley, G.J. |
| description | Lead frame micro-electronic packages are still the most widely used in the semiconductor industry. The surface properties of metal lead frames are involved in several important interfacial interactions within micro-electronic packages and hence have crucial impact on package integrity and reliability. In this work, detailed investigations were carried out to elucidate the chemical compositions of surface treatment solutions as well as the chemical and physical properties of lead frame surfaces. Results from /sup 1/H nuclear magnetic resonance (NMR), X-ray photoelectron spectroscopy (XPS), optical microscopy, and static secondary ion mass spectroscopy (SSIMS) are described. Adhesion testing data obtained from lead frames with different surface treatments, and with die attach adhesives of various chemistries, are reported. In addition, JEDEC reliability tests, using a new die attach adhesive, were performed on molded packages with different packaging material combinations and the results are reported. |
| doi_str_mv | 10.1109/ECTC.2002.1008215 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>pascalfrancis_6IE</sourceid><recordid>TN_cdi_ieee_primary_1008215</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1008215</ieee_id><sourcerecordid>15453628</sourcerecordid><originalsourceid>FETCH-LOGICAL-g253t-7bcda1c7fa13356d14bc6a2a230bf113ce08128078203f9b17e5f668d0c9fd5d3</originalsourceid><addsrcrecordid>eNpFkM1LAzEQxYMfYKn9A8RLLh63TpIm2T3K4hcU9NCey2wyKdHdtSTx0P_elQoOA-_wfgzvDWM3ApZCQHP_2G7apQSQSwFQS6HP2EwqayttpTlni8bWMK2yKwVwwWagTVNpDeqKLXL-gGk0mKa2M_a-HT2lXHD0cdzzntDzkHAgnr9TQEe8JMIy0Fj4xPBYMo_DAV3hXyOf9BP3xBP1EbvYx3K8ZpcB-0yLP52z7dPjpn2p1m_Pr-3DutpLrUplO-dROBtQKKWNF6vOGZQoFXRBCOUIaiF_a0hQoemEJR2MqT24Jnjt1Zzdne4eMDvsp8yji3l3SHHAdNwJvdLKyHribk9cJKJ_-_Q39QN-KV7c</addsrcrecordid><sourcetype>Index Database</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Understanding lead frame surface treatment and its impact on package reliability</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Renyi Wang ; Kuder, R. ; Bing Wu ; Emmerson, G.T. ; Seeley, G.J.</creator><creatorcontrib>Renyi Wang ; Kuder, R. ; Bing Wu ; Emmerson, G.T. ; Seeley, G.J.</creatorcontrib><description>Lead frame micro-electronic packages are still the most widely used in the semiconductor industry. The surface properties of metal lead frames are involved in several important interfacial interactions within micro-electronic packages and hence have crucial impact on package integrity and reliability. In this work, detailed investigations were carried out to elucidate the chemical compositions of surface treatment solutions as well as the chemical and physical properties of lead frame surfaces. Results from /sup 1/H nuclear magnetic resonance (NMR), X-ray photoelectron spectroscopy (XPS), optical microscopy, and static secondary ion mass spectroscopy (SSIMS) are described. Adhesion testing data obtained from lead frames with different surface treatments, and with die attach adhesives of various chemistries, are reported. In addition, JEDEC reliability tests, using a new die attach adhesive, were performed on molded packages with different packaging material combinations and the results are reported.</description><identifier>ISSN: 0569-5503</identifier><identifier>ISBN: 9780780374300</identifier><identifier>ISBN: 0780374304</identifier><identifier>EISSN: 2377-5726</identifier><identifier>DOI: 10.1109/ECTC.2002.1008215</identifier><language>eng</language><publisher>Piscataway NJ: IEEE</publisher><subject>Applied sciences ; Chemicals ; Design. Technologies. Operation analysis. Testing ; Electronics ; Electronics industry ; Exact sciences and technology ; Integrated circuits ; Lead compounds ; Mass spectroscopy ; Microassembly ; Nuclear magnetic resonance ; Optical microscopy ; Particle beam optics ; Semiconductor device packaging ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Surface treatment ; Testing, measurement, noise and reliability</subject><ispartof>52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.947-954</ispartof><rights>2004 INIST-CNRS</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1008215$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1008215$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=15453628$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Renyi Wang</creatorcontrib><creatorcontrib>Kuder, R.</creatorcontrib><creatorcontrib>Bing Wu</creatorcontrib><creatorcontrib>Emmerson, G.T.</creatorcontrib><creatorcontrib>Seeley, G.J.</creatorcontrib><title>Understanding lead frame surface treatment and its impact on package reliability</title><title>52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)</title><addtitle>ECTC</addtitle><description>Lead frame micro-electronic packages are still the most widely used in the semiconductor industry. The surface properties of metal lead frames are involved in several important interfacial interactions within micro-electronic packages and hence have crucial impact on package integrity and reliability. In this work, detailed investigations were carried out to elucidate the chemical compositions of surface treatment solutions as well as the chemical and physical properties of lead frame surfaces. Results from /sup 1/H nuclear magnetic resonance (NMR), X-ray photoelectron spectroscopy (XPS), optical microscopy, and static secondary ion mass spectroscopy (SSIMS) are described. Adhesion testing data obtained from lead frames with different surface treatments, and with die attach adhesives of various chemistries, are reported. In addition, JEDEC reliability tests, using a new die attach adhesive, were performed on molded packages with different packaging material combinations and the results are reported.</description><subject>Applied sciences</subject><subject>Chemicals</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electronics</subject><subject>Electronics industry</subject><subject>Exact sciences and technology</subject><subject>Integrated circuits</subject><subject>Lead compounds</subject><subject>Mass spectroscopy</subject><subject>Microassembly</subject><subject>Nuclear magnetic resonance</subject><subject>Optical microscopy</subject><subject>Particle beam optics</subject><subject>Semiconductor device packaging</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Surface treatment</subject><subject>Testing, measurement, noise and reliability</subject><issn>0569-5503</issn><issn>2377-5726</issn><isbn>9780780374300</isbn><isbn>0780374304</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2002</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFkM1LAzEQxYMfYKn9A8RLLh63TpIm2T3K4hcU9NCey2wyKdHdtSTx0P_elQoOA-_wfgzvDWM3ApZCQHP_2G7apQSQSwFQS6HP2EwqayttpTlni8bWMK2yKwVwwWagTVNpDeqKLXL-gGk0mKa2M_a-HT2lXHD0cdzzntDzkHAgnr9TQEe8JMIy0Fj4xPBYMo_DAV3hXyOf9BP3xBP1EbvYx3K8ZpcB-0yLP52z7dPjpn2p1m_Pr-3DutpLrUplO-dROBtQKKWNF6vOGZQoFXRBCOUIaiF_a0hQoemEJR2MqT24Jnjt1Zzdne4eMDvsp8yji3l3SHHAdNwJvdLKyHribk9cJKJ_-_Q39QN-KV7c</recordid><startdate>2002</startdate><enddate>2002</enddate><creator>Renyi Wang</creator><creator>Kuder, R.</creator><creator>Bing Wu</creator><creator>Emmerson, G.T.</creator><creator>Seeley, G.J.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope><scope>IQODW</scope></search><sort><creationdate>2002</creationdate><title>Understanding lead frame surface treatment and its impact on package reliability</title><author>Renyi Wang ; Kuder, R. ; Bing Wu ; Emmerson, G.T. ; Seeley, G.J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-g253t-7bcda1c7fa13356d14bc6a2a230bf113ce08128078203f9b17e5f668d0c9fd5d3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Applied sciences</topic><topic>Chemicals</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electronics</topic><topic>Electronics industry</topic><topic>Exact sciences and technology</topic><topic>Integrated circuits</topic><topic>Lead compounds</topic><topic>Mass spectroscopy</topic><topic>Microassembly</topic><topic>Nuclear magnetic resonance</topic><topic>Optical microscopy</topic><topic>Particle beam optics</topic><topic>Semiconductor device packaging</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Surface treatment</topic><topic>Testing, measurement, noise and reliability</topic><toplevel>online_resources</toplevel><creatorcontrib>Renyi Wang</creatorcontrib><creatorcontrib>Kuder, R.</creatorcontrib><creatorcontrib>Bing Wu</creatorcontrib><creatorcontrib>Emmerson, G.T.</creatorcontrib><creatorcontrib>Seeley, G.J.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection><collection>Pascal-Francis</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Renyi Wang</au><au>Kuder, R.</au><au>Bing Wu</au><au>Emmerson, G.T.</au><au>Seeley, G.J.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Understanding lead frame surface treatment and its impact on package reliability</atitle><btitle>52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)</btitle><stitle>ECTC</stitle><date>2002</date><risdate>2002</risdate><spage>947</spage><epage>954</epage><pages>947-954</pages><issn>0569-5503</issn><eissn>2377-5726</eissn><isbn>9780780374300</isbn><isbn>0780374304</isbn><abstract>Lead frame micro-electronic packages are still the most widely used in the semiconductor industry. The surface properties of metal lead frames are involved in several important interfacial interactions within micro-electronic packages and hence have crucial impact on package integrity and reliability. In this work, detailed investigations were carried out to elucidate the chemical compositions of surface treatment solutions as well as the chemical and physical properties of lead frame surfaces. Results from /sup 1/H nuclear magnetic resonance (NMR), X-ray photoelectron spectroscopy (XPS), optical microscopy, and static secondary ion mass spectroscopy (SSIMS) are described. Adhesion testing data obtained from lead frames with different surface treatments, and with die attach adhesives of various chemistries, are reported. In addition, JEDEC reliability tests, using a new die attach adhesive, were performed on molded packages with different packaging material combinations and the results are reported.</abstract><cop>Piscataway NJ</cop><pub>IEEE</pub><doi>10.1109/ECTC.2002.1008215</doi><tpages>8</tpages></addata></record> |
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| identifier | ISSN: 0569-5503 |
| ispartof | 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.947-954 |
| issn | 0569-5503 2377-5726 |
| language | eng |
| recordid | cdi_ieee_primary_1008215 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Applied sciences Chemicals Design. Technologies. Operation analysis. Testing Electronics Electronics industry Exact sciences and technology Integrated circuits Lead compounds Mass spectroscopy Microassembly Nuclear magnetic resonance Optical microscopy Particle beam optics Semiconductor device packaging Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Surface treatment Testing, measurement, noise and reliability |
| title | Understanding lead frame surface treatment and its impact on package reliability |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T09%3A24%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-pascalfrancis_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Understanding%20lead%20frame%20surface%20treatment%20and%20its%20impact%20on%20package%20reliability&rft.btitle=52nd%20Electronic%20Components%20and%20Technology%20Conference%202002.%20(Cat.%20No.02CH37345)&rft.au=Renyi%20Wang&rft.date=2002&rft.spage=947&rft.epage=954&rft.pages=947-954&rft.issn=0569-5503&rft.eissn=2377-5726&rft.isbn=9780780374300&rft.isbn_list=0780374304&rft_id=info:doi/10.1109/ECTC.2002.1008215&rft_dat=%3Cpascalfrancis_6IE%3E15453628%3C/pascalfrancis_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1008215&rfr_iscdi=true |