Training program in electronic passive components education
One of the dynamic developments in electronic components is in passive components. More and more requirements are coming from the end users, the equipment developers. At the same time, new electronic packaging technology requires new component features. These features must be seen from a wide perspe...
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| creator | Svasta, P. Golumbeanu, V. Ionescu, C. Codreanu, N.D. Leonescu, D. Vladescu, M. Vuza, D.T. |
| description | One of the dynamic developments in electronic components is in passive components. More and more requirements are coming from the end users, the equipment developers. At the same time, new electronic packaging technology requires new component features. These features must be seen from a wide perspective that includes electrical, mechanical, thermal, technological and other points of view. This huge amount of knowledge must be appropriate for the packaging engineers. In the near future the demand for such specialists will dramatically increase and that is why the university must be able to support their education in undergraduate programs and curricula. |
| doi_str_mv | 10.1109/ECTC.2002.1008188 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>pascalfrancis_6IE</sourceid><recordid>TN_cdi_ieee_primary_1008188</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1008188</ieee_id><sourcerecordid>15453704</sourcerecordid><originalsourceid>FETCH-LOGICAL-i203t-9b6ea71081c62be47dbece8327f61d6a43c7d8662abbc9d1aac6f903d1c32a693</originalsourceid><addsrcrecordid>eNpFUE1Lw0AUXPwAS-0PEC-5eEx8u5v9wpOEVoWCl3ouL5uXstJuwm4U_PcGKjgMzGGGYRjG7jhUnIN7XDe7phIAouIAllt7wRZCGlMqI_QlWzljYaY0tQS4YgtQ2pVKgbxhq5w_YYYC7axZsKddwhBDPBRjGg4JT0WIBR3JT2mIwRcj5hy-qfDDaRwixSkX1H15nMIQb9l1j8dMqz9dso_Nete8ltv3l7fmeVsGAXIqXasJDZ-Hei1aqk3Xkicrhek17zTW0pvOai2wbb3rOKLXvQPZcS8FaieX7OHcO4_xeOwTRh_yfkzhhOlnz1WtpIF6zt2fc4GI_u3zRfIXVnVYKg</addsrcrecordid><sourcetype>Index Database</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Training program in electronic passive components education</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Svasta, P. ; Golumbeanu, V. ; Ionescu, C. ; Codreanu, N.D. ; Leonescu, D. ; Vladescu, M. ; Vuza, D.T.</creator><creatorcontrib>Svasta, P. ; Golumbeanu, V. ; Ionescu, C. ; Codreanu, N.D. ; Leonescu, D. ; Vladescu, M. ; Vuza, D.T.</creatorcontrib><description>One of the dynamic developments in electronic components is in passive components. More and more requirements are coming from the end users, the equipment developers. At the same time, new electronic packaging technology requires new component features. These features must be seen from a wide perspective that includes electrical, mechanical, thermal, technological and other points of view. This huge amount of knowledge must be appropriate for the packaging engineers. In the near future the demand for such specialists will dramatically increase and that is why the university must be able to support their education in undergraduate programs and curricula.</description><identifier>ISSN: 0569-5503</identifier><identifier>ISBN: 9780780374300</identifier><identifier>ISBN: 0780374304</identifier><identifier>EISSN: 2377-5726</identifier><identifier>DOI: 10.1109/ECTC.2002.1008188</identifier><language>eng</language><publisher>Piscataway NJ: IEEE</publisher><subject>Applied sciences ; Capacitors ; Ceramics ; Design. Technologies. Operation analysis. Testing ; Educational programs ; Electronic components ; Electronic equipment ; Electronic packaging thermal management ; Electronics ; Electronics packaging ; Exact sciences and technology ; Impedance ; Integrated circuits ; Packaging machines ; Resistors ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><ispartof>52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.780-786</ispartof><rights>2004 INIST-CNRS</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1008188$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,4036,4037,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1008188$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=15453704$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Svasta, P.</creatorcontrib><creatorcontrib>Golumbeanu, V.</creatorcontrib><creatorcontrib>Ionescu, C.</creatorcontrib><creatorcontrib>Codreanu, N.D.</creatorcontrib><creatorcontrib>Leonescu, D.</creatorcontrib><creatorcontrib>Vladescu, M.</creatorcontrib><creatorcontrib>Vuza, D.T.</creatorcontrib><title>Training program in electronic passive components education</title><title>52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)</title><addtitle>ECTC</addtitle><description>One of the dynamic developments in electronic components is in passive components. More and more requirements are coming from the end users, the equipment developers. At the same time, new electronic packaging technology requires new component features. These features must be seen from a wide perspective that includes electrical, mechanical, thermal, technological and other points of view. This huge amount of knowledge must be appropriate for the packaging engineers. In the near future the demand for such specialists will dramatically increase and that is why the university must be able to support their education in undergraduate programs and curricula.</description><subject>Applied sciences</subject><subject>Capacitors</subject><subject>Ceramics</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Educational programs</subject><subject>Electronic components</subject><subject>Electronic equipment</subject><subject>Electronic packaging thermal management</subject><subject>Electronics</subject><subject>Electronics packaging</subject><subject>Exact sciences and technology</subject><subject>Impedance</subject><subject>Integrated circuits</subject><subject>Packaging machines</subject><subject>Resistors</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><issn>0569-5503</issn><issn>2377-5726</issn><isbn>9780780374300</isbn><isbn>0780374304</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2002</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFUE1Lw0AUXPwAS-0PEC-5eEx8u5v9wpOEVoWCl3ouL5uXstJuwm4U_PcGKjgMzGGGYRjG7jhUnIN7XDe7phIAouIAllt7wRZCGlMqI_QlWzljYaY0tQS4YgtQ2pVKgbxhq5w_YYYC7axZsKddwhBDPBRjGg4JT0WIBR3JT2mIwRcj5hy-qfDDaRwixSkX1H15nMIQb9l1j8dMqz9dso_Nete8ltv3l7fmeVsGAXIqXasJDZ-Hei1aqk3Xkicrhek17zTW0pvOai2wbb3rOKLXvQPZcS8FaieX7OHcO4_xeOwTRh_yfkzhhOlnz1WtpIF6zt2fc4GI_u3zRfIXVnVYKg</recordid><startdate>2002</startdate><enddate>2002</enddate><creator>Svasta, P.</creator><creator>Golumbeanu, V.</creator><creator>Ionescu, C.</creator><creator>Codreanu, N.D.</creator><creator>Leonescu, D.</creator><creator>Vladescu, M.</creator><creator>Vuza, D.T.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope><scope>IQODW</scope></search><sort><creationdate>2002</creationdate><title>Training program in electronic passive components education</title><author>Svasta, P. ; Golumbeanu, V. ; Ionescu, C. ; Codreanu, N.D. ; Leonescu, D. ; Vladescu, M. ; Vuza, D.T.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i203t-9b6ea71081c62be47dbece8327f61d6a43c7d8662abbc9d1aac6f903d1c32a693</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Applied sciences</topic><topic>Capacitors</topic><topic>Ceramics</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Educational programs</topic><topic>Electronic components</topic><topic>Electronic equipment</topic><topic>Electronic packaging thermal management</topic><topic>Electronics</topic><topic>Electronics packaging</topic><topic>Exact sciences and technology</topic><topic>Impedance</topic><topic>Integrated circuits</topic><topic>Packaging machines</topic><topic>Resistors</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><toplevel>online_resources</toplevel><creatorcontrib>Svasta, P.</creatorcontrib><creatorcontrib>Golumbeanu, V.</creatorcontrib><creatorcontrib>Ionescu, C.</creatorcontrib><creatorcontrib>Codreanu, N.D.</creatorcontrib><creatorcontrib>Leonescu, D.</creatorcontrib><creatorcontrib>Vladescu, M.</creatorcontrib><creatorcontrib>Vuza, D.T.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection><collection>Pascal-Francis</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Svasta, P.</au><au>Golumbeanu, V.</au><au>Ionescu, C.</au><au>Codreanu, N.D.</au><au>Leonescu, D.</au><au>Vladescu, M.</au><au>Vuza, D.T.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Training program in electronic passive components education</atitle><btitle>52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)</btitle><stitle>ECTC</stitle><date>2002</date><risdate>2002</risdate><spage>780</spage><epage>786</epage><pages>780-786</pages><issn>0569-5503</issn><eissn>2377-5726</eissn><isbn>9780780374300</isbn><isbn>0780374304</isbn><abstract>One of the dynamic developments in electronic components is in passive components. More and more requirements are coming from the end users, the equipment developers. At the same time, new electronic packaging technology requires new component features. These features must be seen from a wide perspective that includes electrical, mechanical, thermal, technological and other points of view. This huge amount of knowledge must be appropriate for the packaging engineers. In the near future the demand for such specialists will dramatically increase and that is why the university must be able to support their education in undergraduate programs and curricula.</abstract><cop>Piscataway NJ</cop><pub>IEEE</pub><doi>10.1109/ECTC.2002.1008188</doi><tpages>7</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0569-5503 |
| ispartof | 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.780-786 |
| issn | 0569-5503 2377-5726 |
| language | eng |
| recordid | cdi_ieee_primary_1008188 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Applied sciences Capacitors Ceramics Design. Technologies. Operation analysis. Testing Educational programs Electronic components Electronic equipment Electronic packaging thermal management Electronics Electronics packaging Exact sciences and technology Impedance Integrated circuits Packaging machines Resistors Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
| title | Training program in electronic passive components education |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T21%3A56%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-pascalfrancis_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Training%20program%20in%20electronic%20passive%20components%20education&rft.btitle=52nd%20Electronic%20Components%20and%20Technology%20Conference%202002.%20(Cat.%20No.02CH37345)&rft.au=Svasta,%20P.&rft.date=2002&rft.spage=780&rft.epage=786&rft.pages=780-786&rft.issn=0569-5503&rft.eissn=2377-5726&rft.isbn=9780780374300&rft.isbn_list=0780374304&rft_id=info:doi/10.1109/ECTC.2002.1008188&rft_dat=%3Cpascalfrancis_6IE%3E15453704%3C/pascalfrancis_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1008188&rfr_iscdi=true |